Interfacial Stresses in a Lap Shear Joint (LSJ): The “Transverse Groove Effect” (TGE) von SUHIR, Ephraim, REINIKAINEN, Tommi

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Three- and Four-Point Bend Testing for Electronic Packages von Shetty, Santosh, Reinikainen, Tommi

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Cracking phenomena on flexible-rigid interfaces in PCBs under thermo cycling loading von Arruda, Luciano, Bonadiman, Renato, Costa, Josineto, Reinikainen, Tommi

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Optimal Parameter Selection for Electronic Packaging Using Sequential Computer Simulations von Gupta, Abhishek, Ding, Yu, Xu, Leon, Reinikainen, Tommi

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A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending von Xu, Leon, Reinikainen, Tommi, Ren, Wei, Wang, Bo Ping, Han, Zhenxue, Agonafer, Dereje

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Cracking phenomena on flexiblerigid interfaces in PCBs under thermo cycling loading von Arruda, Luciano, Bonadiman, Renato, Costa, Josineto, Reinikainen, Tommi

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Package to board interconnection shear strength (PBISS): effect of surface finish, PWB build-up layer and chip scale package structure von Canumalla, S., Hee-Dong Yang, Viswanadham, P., Reinikainen, T.O.

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Finite element modelling of a BGA package subjected to thermal and power cycling von Rodgers, B., Punch, J., Jarvis, J.

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Improving pedagogical feedback and objective grading von Ahoniemi, Tuukka, Lahtinen, Essi, Reinikainen, Tommi

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TBGA reliability in telecom environment von Pennanen, Virpi, Tammenmaa, Markku, Reinikainen, Tommi, Zhu, Jiansen, Lin, Wei

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Evaluation of printing parameters and substrate treatmet over the quality of printed silver traces von Bonadiman, R., Marques, M., Freitas, G., Reinikainen, T.

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Second level packaging interconnection method with improved thermal and reliability performance von Reinikainen, Tommi, Myllykoski, Pirkka

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Second level packaging interconnection method with improved thermal and reliability performance von REINIKAINEN TOMMI, MYLLYKOSKI PIRKKA

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Application of ABAQUS/Explicit submodeling technique in drop simulation of system assembly von Wei Ren, Jianjun Wang, Reinikainen, T.

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Current hardware trends in mobile phones von Reinikainen, T., Costa, A., Freitas, I., Asuncao, E.

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Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA von Hun Shen Ng, Tong Yan Tee, Kim Yong Goh, Jing-en Luan, Reinikainen, T., Hussa, E., Kujala, A.

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Drop impact life prediction model for lead-free BGA packages and modules von Jing-en Luan, Tong Yan Tee, Kim Yong Goh, Hun Shen Ng, Baraton, X., Bronner, R., Sorrieul, M., Hussa, E., Reinikainen, T., Kujala, A.

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Software Comprehension through Concern-based Queries von Reinikainen, T., Hammouda, I., Laiho, J., Koskimies, K., Systa, T.

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A novel response surface method for design optimization of electronic packages von Bo Ping Wang, Zhen Xue Han, Leon Xu, Reinikainen, T.

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Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using finite element modeling von Hossain, M.M., Agonafer, D., Viswanadham, P., Reinikainen, T.

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