Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys von Reeve, Kathlene N., Anderson, Iver E., Handwerker, Carol A.

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Advances in Pb-free Solder Microstructure Control and Interconnect Design von Reeve, Kathlene N., Holaday, John R., Choquette, Stephanie M., Anderson, Iver E., Handwerker, Carol A.

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Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys von Reeve, Kathlene N., Handwerker, Carol A.

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Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows von Reeve, Kathlene N., Choquette, Stephanie M., Anderson, Iver E., Handwerker, Carol A.

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Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders von Reeve, Kathlene N., Choquette, Stephanie M., Anderson, Iver E., Handwerker, Carol A.

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Lead-free composite solder von Anderson Iver E, Choquette Stephanie M, Harringa Joel L, Reeve Kathlene N

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