Dominant factors for fracture at the micro-scale in electrodeposited nickel alloys von Martin, May L., Liew, Li-Anne, Read, David T., Christenson, Todd R., DelRio, Frank W., Geaney, John

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Elastic-plastic properties of mesoscale electrodeposited LIGA nickel alloy films: microscopy and mechanics von Liew, Li-Anne, Read, David T, Martin, May L, DelRio, Frank W, Bradley, Peter E, Barbosa, Nicholas, Christenson, Todd R, Geaney, John T

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Elastic–Plastic Properties of Mesoscale Electrodeposited LIGA Nickel Alloy Films: Analysis of Measurement Uncertainties von Liew, Li-Anne, Read, David T., Martin, May L., Bradley, Peter E., Geaney, John T.

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Microfabricated fiducial markers for digital image correlation-based micromechanical testing of LIGA Ni alloys von Liew, Li-Anne, Read, David T., Martin, May L., Christenson, Todd R., Geaney, John T.

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Failure Analysis and Reliability of Low-Temperature-Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits von Chiaramonti, Ann N., Vollebregt, Sten, Sanders, Aric W., Ishihara, Ryoichi, Read, David T.

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Electromigration of Cu interconnects under AC and DC test conditions von Shaviv, Roey, Harm, Gregory J., Kumari, Sangita, Keller, Robert R., Read, David T.

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Defect behavior in aluminum interconnect lines deformed thermomechanically by cyclic joule heating von Geiss, Roy H., Read, David T.

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Influence of tip bluntness on the size-dependent nanoindentation hardness von Kim, Ju-Young, Lee, Baik-Woo, Read, David T., Kwon, Dongil

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Tensile properties of free-standing aluminum thin films von Read, David T, Cheng, Yi-Wen, Keller, Robert R, McColskey, J.David

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A tensile-testing technique for micrometer-sized free-standing thin films von Cheng, Yi-Wen, Read, David T., McColskey, J. David, Wright, Joyce E.

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Nanoindentation round robin on thin film copper on silicon von READ, David T, KELLER, Robert R, BARBOSA, N, GEISS, R

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Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures von Suwito, Wan, Dunn, Martin L., Cunningham, Shawn J., Read, David T.

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Young's modulus of thin films by speckle interferometry von Read, David T

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EBSD Analysis of Narrow Damascene Copper Lines von Geiss, Roy H, Read, David T, Alers, Glenn B, Graham, Rebekah L

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Need for Standardization of EBSD Measurements for Microstructural Characterization of Thin Film Structures von Geiss, Roy H, Read, David T

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Theory of Electron Beam Moiré von Read, David T, Dally, James W

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Effects of barrier composition and electroplating chemistry on adhesion and voiding in copper/dielectric diffusion barrier films von Birringer, Ryan P., Shaviv, Roey, Geiss, Roy H., Read, David T., Dauskardt, Reinhold H.

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Atomistic simulation of modulus deficit in an aggregate of metal spheres von Read, David T.

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Hunger of Gold: Guyon, Mammon's Cave, and the New World Treasure von READ, DAVID T.

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Experimental Study of Shear and Tensile Properties of LIGA Ni-Fe and Ni-Co Alloys at Quasi-static and Intermediate Strain Rates von Liew, Li-Anne, Read, David T., Martin, May L., Christenson, Todd R., Bradley, Peter E., Barbosa, Nicholas, DelRio, Frank W., Smyth, Jeffrey R., Geaney, John T.

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