Synthetic gecko foot-hairs from multiwalled carbon nanotubes von Yurdumakan, Betul, Raravikar, Nachiket R, Ajayan, Pulickel M, Dhinojwala, Ali

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Embedded Carbon-Nanotube-Stiffened Polymer Surfaces von Raravikar, Nachiket R., Vijayaraghavan, Aravind S., Keblinski, Pawel, Schadler, Linda S., Ajayan, Pulickel M.

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Synthesis and Characterization of Thickness-Aligned Carbon Nanotube−Polymer Composite Films von Raravikar, Nachiket R, Schadler, Linda S, Vijayaraghavan, Aravind, Zhao, Yiping, Wei, Bingqing, Ajayan, Pulickel M

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Adhesional shear strength and surface analysis of a PV module deployed in harsh coastal climate von Dhere, Neelkanth G., Raravikar, Nachiket R.

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Enzyme−Polymer−Single Walled Carbon Nanotube Composites as Biocatalytic Films von Rege, Kaushal, Raravikar, Nachiket R, Kim, Dae-Yun, Schadler, Linda S, Ajayan, Pulickel M, Dordick, Jonathan S

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Temperature dependence of radial breathing mode Raman frequency of single-walled carbon nanotubes von Raravikar, Nachiket R., Keblinski, Pawel, Rao, Apparao M., Dresselhaus, Mildred S., Schadler, Linda S., Ajayan, Pulickel M.

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Embedded Carbon -Nanotube-Stiffened Polymer Surfaces von Raravikar, Nachiket R, Vijayaraghavan, Aravind S, Keblinski, Pawel, Schadler, Linda S, Ajayan, Pulickel M

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ADHESIVE WITH TUNABLE ADHESION FOR HANDLING ULTRA-THIN WAFER von RARAVIKAR, Nachiket R, MAMODIA, Mohit

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Methods of utilizing low temperature solder assisted mounting techniques for package structures von Raravikar, Nachiket R, Sane, Sandeep B, Karhade, Omkar G

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METHODS OF UTILIZING LOW TEMPERATURE SOLDER ASSISTED MOUNTING TECHNIQUES FOR PACKAGE STRUCTURES von Raravikar, Nachiket R, Sane, Sandeep B, Karhade, Omkar G

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Heat spreader edge standoffs for managing bondline thickness in microelectronic packages von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Semiconductor package with electromagnetic interference shielding von Dias, Rajendra C, Raravikar, Nachiket R

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ADHESIVE WITH TUNABLE ADHESION FOR HANDLING ULTRA-THIN WAFER von MAMODIA MOHIT, RARAVIKAR NACHIKET R

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VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES von COMBS, Christopher, MALATKAR, Pramod, HUETTIS, Alexander, RARAVIKAR, Nachiket R, SOOD, Mohit, LU, Jiongxin, HARPER, John, ZHANG, Jieping, DEPPISCH, Carl, KLEIN, Steven A, LU, Xiao

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SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING von Dias, Rajendra C, Raravikar, Nachiket R

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Varied ball ball-grid-array (BGA) packages von Lu, Jiongxin, Combs, Christopher, Raravikar, Nachiket R, Lu, Xiao, Malatkar, Pramod, Harper, John, Klein, Steven A, Sood, Mohit, Zhang, Jieping, Huettis, Alexander, Deppisch, Carl

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LPS solder paste based low cost fine pitch pop interconnect solutions von Mathkar, Akshay, Raravikar, Nachiket R, Matayabas, Jr., James C

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HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Heat spreader edge standoffs for managing bondline thickness in microelectronic packages von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING von DIAS, Rajendra C, RARAVIKAR, Nachiket R

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