The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering von Ramli, M.I.I., Mohd Salleh, M.A.A., Yasuda, H., Chaiprapa, J., Nogita, K.

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Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder von Ramli, M.I.I., Saud, N., Salleh, M.A.A. Mohd, Derman, M.N., Said, R. Mohd

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Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder von Ramli, M.I.I., Mohd Salleh, M.A.A., Derman, M.N., Said, R.M., Saud, N.

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The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy von Chang, M.S., Salleh, M.A.A. Mohd, Halin, D.S.C., Ramli, M.I.I., Yasuda, H., Nogita, K.

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Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder von Ramli, M.I.I., Saud, N., Salleh, M.A.A. Mohd, Derman, M.N., Said, R. Mohd

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Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg von Tan, C.Y., Salleh, M.A.A. Mohd, Tan, X.F., Yasuda, H., Saud, N., Ramli, M.I.I., Nogita, K.

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Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin Based Geopolymer von M.I.I. Ramli, M.A.A.M. Salleh, I.H. Aziz, N.S.M. Zaimi, S.F.M. Amli, M.M.A.B. Abdullah

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Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin Based Geopolymer von Ramli, M.I.I., Salleh, M.A.A.M., Aziz, I.H., Zaimi, N.S.M., Amli, S.F.M., Abdullah, M.M.A.B.

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