Evolution of structure, morphology, and reactivity of hydrogenated amorphous silicon film surfaces grown by molecular-dynamics simulation von Ramalingam, Shyam, Sriraman, Saravanapriyan, Aydil, Eray S., Maroudas, Dimitrios

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Mechanism and energetics of dissociative adsorption of SiH3 on the hydrogen-terminated Si(001)-(2×1) surface von Walch, Stephen P., Ramalingam, Shyam, Aydil, Eray S., Maroudas, Dimitrios

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Mechanisms and energetics of SiH3 adsorption on the pristine Si(0 0 1)-(2 × 1) surface von WALCH, Stephen P, RAMALINGAM, Shyam, SRIRAMAN, Saravanapriyan, AYDIL, Eray S, MAROUDAS, Dimitrios

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Atomistic simulation study of the interactions of SiH3 radicals with silicon surfaces von Ramalingam, Shyam, Maroudas, Dimitrios, Aydil, Eray S.

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Interactions of SiH radicals with silicon surfaces: An atomic-scale simulation study von Ramalingam, Shyam, Maroudas, Dimitrios, Aydil, Eray S.

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Theoretical study of the interactions of SiH2 radicals with silicon surfaces von Ramalingam, Shyam, Mahalingam, Pushpa, Aydil, Eray S., Maroudas, Dimitrios

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Abstraction of hydrogen by SiH3 from hydrogen-terminated Si(001)-(2×1) surfaces von RAMALINGAM, S, MAROUDAS, D, AYDIL, E. S, WALCH, S. P

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Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods von Lu, Jin, Ramalingam, Shyam, Li, Hongqi, Jindal, Anurag

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Atomistic simulation of SiH interactions with silicon surfaces during deposition from silane containing plasmas von Ramalingam, Shyam, Maroudas, Dimitrios, Aydil, Eray S.

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Interconnect assemblies with through-silicon vias and stress-relief features von Damarla, Gowrisankar, Lu, Jin, Ramalingam, Shyam, Li, Hongqi, Jindal, Anurag

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CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL EXPANSION MATERIALS AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS von Lu, Jin, Ramalingam, Shyam, Li, Hongqi, Jindal, Anurag

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Mechanism and energetics of dissociative adsorption of SiH 3 on the hydrogen-terminated Si [formula omitted]-(2×1) surface von Walch, Stephen P., Ramalingam, Shyam, Aydil, Eray S., Maroudas, Dimitrios

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Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods von Lu, Jin, Ramalingam, Shyam, Li, Hongqi, Jindal, Anurag

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CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL EXPANSION MATERIALS AND ASSOCIATED METHODS von LU, Jin, LI, Hongqi, RAMALINGAM, Shyam, JINDAL, Anurag

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Mechanisms and energetics of SiH 3 adsorption on the pristine Si(0 0 1)-(2×1) surface von Walch, Stephen P., Ramalingam, Shyam, Sriraman, Saravanapriyan, Aydil, Eray S., Maroudas, Dimitrios

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CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL EXPANSION MATERIALS AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS von Lu, Jin, Ramalingam, Shyam, Li, Hongqi, Jindal, Anurag

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Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods von Li Hongqi, Ramalingam Shyam, Lu Jin, Jindal Anurag

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Abstraction of hydrogen by SiH 3 from hydrogen-terminated Si(001)-(2×1) surfaces von Ramalingam, Shyam, Maroudas, Dimitrios, Aydil, Eray S, Walch, Stephen P

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CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL EXPANSION MATERIALS AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS von Li Hongqi, Ramalingam Shyam, Lu Jin, Jindal Anurag

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Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods von Li Hongqi, Ramalingam Shyam, Lu Jin, Jindal Anurag

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