PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STRUCTURES von Rajalingam, Sankeerth, Wagner, Grant, Audette, David M, DiMilia, Doreen D, Chey, S J

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PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STRUCTURES von Rajalingam, Sankeerth, Wagner, Grant, Audette, David M, DiMilia, Doreen D, Chey, S J

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PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING von Rajalingam, Sankeerth, Conti, Dennis R, Wagner, Grant, Audette, David M, Chey, Sukjay, Knox, Marc D, Speltz, Cedric

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PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING von Rajalingam, Sankeerth, Conti, Dennis R, Wagner, Grant, Audette, David M, Chey, Sukjay, Knox, Marc D, Speltz, Cedric

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Organic probe substrate von Maher, John R, Rajalingam, Sankeerth, Gardell, David L, Audette, David M, Cordes, Steven A, Roy, III, Frederick H, Chey, Sukjay J, Fortin, Anthony D

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ORGANIC PROBE SUBSTRATE von ROY, III Frederick H, FORTIN Anthony D, MAHER, III John R, AUDETTE David M, CHEY Sukjay J, GARDELL David L, CORDES Steven A, RAJALINGAM Sankeerth

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