In Situ Study of the Growth Kinetics of Individual Island Electrodeposition of Copper von Radisic, A, Ross, F. M, Searson, P. C

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The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates von Nagar, M., Radisic, A., Strubbe, K., Vereecken, P.M.

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The morphology and nucleation kinetics of copper islands during electrodeposition von Radisic, A., Vereecken, P.M., Searson, P.C., Ross, F.M.

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The Effect of Polyether Suppressors on the Nucleation and Growth of Copper on RuTa Seeded Substrate for Direct Copper Plating von Nagar, M., Radisic, A., Strubbe, K., Vereecken, P.M.

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Copper plating for 3D interconnects von Radisic, A., Lühn, O., Philipsen, H.G.G., El-Mekki, Z., Honore, M., Rodet, S., Armini, S., Drijbooms, C., Bender, H., Ruythooren, W.

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Optogenetic Control of Cardiomyocytes via Viral Delivery von Ambrosi, Christina M., Entcheva, Emilia

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Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed von Armini, S., El-Mekki, Z., Vandersmissen, K., Philipsen, H., Rodet, S., Honore, M., Radisic, A., Civale, Y., Beyne, E., Leunissen, L.

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Interrupting Endocrine Therapy to Attempt Pregnancy after Breast Cancer von Partridge, Ann H., Niman, Samuel M., Ruggeri, Monica, Peccatori, Fedro A., Azim, Hatem A., Colleoni, Marco, Saura, Cristina, Shimizu, Chikako, Sætersdal, Anna B., Kroep, Judith R., Mailliez, Audrey, Warner, Ellen, Borges, Virginia F., Amant, Frédéric, Gombos, Andrea, Kataoka, Akemi, Rousset-Jablonski, Christine, Borstnar, Simona, Takei, Junko, Lee, Jeong E., Walshe, Janice M., Ruíz-Borrego, Manuel, Moore, Halle C.F., Saunders, Christobel, Bjelic-Radisic, Vesna, Susnjar, Snezana, Cardoso, Fatima, Smith, Karen L., Ferreiro, Teresa, Ribi, Karin, Ruddy, Kathryn, Kammler, Roswitha, El-Abed, Sarra, Viale, Giuseppe, Piccart, Martine, Korde, Larissa A., Goldhirsch, Aron, Gelber, Richard D., Pagani, Olivia

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Injectable ECM Scaffolds for Cardiac Repair von Johnson, Todd D., Braden, Rebecca L., Christman, Karen L.

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Fabrication of Complex Architectures Using Electrodeposition into Patterned Self-Assembled Monolayers von Pesika, Noshir S., Radisic, A., Stebe, Kathleen J., Searson, Peter C.

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Structural characterization of through silicon vias von Bender, H., Drijbooms, C., Van Marcke, P., Geypen, J., Philipsen, H. G. G., Radisic, A.

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Cell Sheet Technology for Cardiac Tissue Engineering von Haraguchi, Yuji, Shimizu, Tatsuya, Matsuura, Katsuhisa, Sekine, Hidekazu, Tanaka, Nobuyuki, Tadakuma, Kenjiro, Yamato, Masayuki, Kaneko, Makoto, Okano, Teruo

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High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed von Druais, G., Dilliway, G., Fischer, P., Guidotti, E., Lühn, O., Radisic, A., Zahraoui, S.

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Electrochemical fabrication of platinum interconnects for implantable electronic devices von Radisic, A., Morcos, B.M., Op de Beeck, M., O’Callaghan, J.M., Van Hoof, C.

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(Invited) Wafer Scale Copper Direct Plating on Thin PVD RuTa Layers: A Route to Enable Filling 30 nm Features and Below von Armini, Silvia, El-Mekki, Zaid, Nagar, Magi, Radisic, Alex, Ruythooren, W., Vereecken, Philippe M.

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Methods for Assessing the Electromechanical Integration of Human Pluripotent Stem Cell-Derived Cardiomyocyte Grafts von Zhu, Wei-Zhong, Filice, Dominic, Palpant, Nathan J., Laflamme, Michael A.

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Differential Inhibition during Cu Electrodeposition on Ru: Combined Electrochemical and Real-Time TEM Studies von Vereecken, P. M., Radisic, A., Ross, F. M.

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Island growth in electrodeposition von Guo, Lian, Oskam, Gerko, Radisic, Aleksandar, Hoffmann, Peter M, Searson, Peter C

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Quantifying Electrical Interactions Between Cardiomyocytes and Other Cells in Micropatterned Cell Pairs von Nguyen, Hung, Badie, Nima, McSpadden, Luke, Pedrotty, Dawn, Bursac, Nenad

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Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures von Yang, Y., Labie, R., Ling, F., Zhao, C., Radisic, A., Van Olmen, J., Travaly, Y., Verlinden, B., De Wolf, I.

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