Impact of “terminal effect” on Cu electrochemical deposition: Filling capability for different metallization options von Armini, Silvia, Tokei, Zsolt, Volders, Henny, El-Mekki, Zaid, Radisic, Aleksandar, Beyer, Gerald, Ruythooren, Wouter, Vereecken, Philippe M.

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Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions von Labie, Riet, Ruythooren, Wouter, Van Humbeeck, Jan

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Design Issues and Considerations for Low-Cost 3-D TSV IC Technology von Van der Plas, G, Limaye, P, Loi, I, Mercha, A, Oprins, H, Torregiani, C, Thijs, S, Linten, D, Stucchi, M, Katti, G, Velenis, D, Cherman, V, Vandevelde, B, Simons, V, De Wolf, I, Labie, R, Perry, D, Bronckers, S, Minas, N, Cupac, M, Ruythooren, W, Van Olmen, J, Phommahaxay, A, de Potter de ten Broeck, M, Opdebeeck, A, Rakowski, M, De Wachter, B, Dehan, M, Nelis, M, Agarwal, R, Pullini, A, Angiolini, F, Benini, L, Dehaene, W, Travaly, Y, Beyne, E, Marchal, P

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Improved Thermal Performance of AlGaN/GaN HEMTs by an Optimized Flip-Chip Design von Das, J., Oprins, H., Hangfeng Ji, Sarua, A., Ruythooren, W., Derluyn, J., Kuball, M., Germain, M., Borghs, G.

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The RELAXd project: Development of four-side tilable photon-counting imagers von Vykydal, Zdenek, Visschers, Jan, Tezcan, Deniz Sabuncuoglu, De Munck, Koen, Borgers, Tom, Ruythooren, Wouter, De Moor, Piet

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Challenges for Capillary Self-Assembly of Microsystems von Mastrangeli, M, Ruythooren, W, Celis, J, Van Hoof, C

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Filling of microvia with an aspect ratio of 5 by copper electrodeposition von Lühn, Ole, Van Hoof, Christiaan, Ruythooren, Wouter, Celis, Jean-Pierre

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Conformal dip-coating of patterned surfaces for capillary die-to-substrate self-assembly von Mastrangeli, Massimo, Ruythooren, Wouter, Van Hoof, Christiaan, Celis, Jean-Pierre

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Monitoring the superfilling of blind holes with electrodeposited copper von Lühn, O, Radisic, A, Van Hoof, Christiaan, Ruythooren, Wouter, Celis, Jean-Pierre

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Through-silicon via and die stacking technologies for microsystems-integration von Beyne, E., De Moor, P., Ruythooren, W., Labie, R., Jourdain, A., Tilmans, H., Tezcan, D.S., Soussan, P., Swinnen, B., Cartuyvels, R.

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Three-dimensional thermal analysis of a flip-chip mounted AlGaN/GaN HFET using confocal micro-Raman spectroscopy von Hangfeng Ji, Kuball, M., Sarua, A., Jo Das, Ruythooren, W., Germain, M., Borghs, G.

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Design issues and considerations for low-cost 3D TSV IC technology von Van der Plas, G., Limaye, P., Mercha, A., Oprins, H., Torregiani, C., Thijs, S., Linten, D., Stucchi, M., Guruprasad, K., Velenis, D., Shinichi, D., Cherman, V., Vandevelde, B., Simons, V., De Wolf, I., Labie, R., Perry, D., Bronckers, S., Minas, N., Cupac, M., Ruythooren, W., Van Olmen, J., Phommahaxay, A., de Potter de ten Broeck, M., Opdebeeck, A., Rakowski, M., De Wachter, B., Dehan, M., Nelis, M., Agarwal, R., Dehaene, W., Travaly, Y., Marchal, P., Beyne, E.

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Solid state diffusion in Cu-Sn and Ni-Sn diffusion couples with flip-chip scale dimensions von Labie, Riet, Ruythooren, Wouter, Van Humbeeck, Jan

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Mechanistic Insights of Copper Damascene Plating in Small and Large Features von Vereecken, Philippe M., Ruythooren, Wouter

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Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD processes von Luhn, Ole, Van Hoof, Christiaan, Ruythooren, Wouter, Celis, Jean-Pierre

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Challenges for capillary self-assembly of microsystems von Mastrangeli, Massimo, Ruythooren, Wouter, Celis, Jean-Pierre, Van Hoof, Chris

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Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking von Labie, Riet, Ruythooren, Wouter, Baert, Kris, Beyne, Eric, Swinnen, Bart

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Copper Plating on Resistive Substrates, Diffusion Barrier and Alternative Seed Layers von Radisic, Aleksandar, Nagar, Magi, Strubbe, Katrien, Armini, Silvia, El-Mekki, Zaid, Volders, Henny, Ruythooren, Wouter, Vereecken, Philippe M.

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Leveling of Microvias by Electroplating for Wafer Level Packaging von Luehn, Ole, Celis, Jean-Pierre, Van Hoof, Chris, Baert, Kris, Ruythooren, Wouter

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Copper Plating for 3D Interconnects von Radisic, Aleksandar, Lühn, Ole, Vaes, Jan, Armini, Silvia, El-Mekki, Zaid, Radisic, Dunja, Ruythooren, Wouter, Vereecken, Philippe M.

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