Investigation Into the Scalability of Selectively Implanted Buried Subcollector (SIBS) for Submicrometer InP DHBTs von Li, James Chingwei, Chow, David H., Asbeck, Peter M., Sokolich, Marko, Royter, Yakov, Hussain, Tahir, Chen, Mary Y., Fields, Charles H., Rajavel, Rajesh D., Bui, Steven S., Shi, Binqiang, Hitko, Donald A.

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Passive Millimeter-Wave Imaging Module With Preamplified Zero-Bias Detection von Lynch, J.J., Moyer, H.P., Schaffner, J.H., Royter, Y., Sokolich, M., Hughes, B., Yoon, Y.J., Schulman, J.N.

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0.8/2.2-GHz Programmable Active Bandpass Filters in InP/Si BiCMOS Technology von Zhiwei Xu, Winklea, Deborah, Oh, Thomas C., Kim, Samuel, Chen, Steven T. W., Royter, Yakov, Lau, Maggy, Valles, Irma, Hitko, Donald A., Li, James C., Gu, Q. Jane

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Microfabrication Technology for Millimeter-Wave Photonic Systems on Si von Ishii, Hiromu, Minotani, Tadashi, Royter, Yakov, Yagi, Shouji, Kudou, Kazuhisa, Yano, Masaki, Nagatsuma, Tadao, Machida, Katsuyuki, Kyuragi, Hakaru

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100 GHz+ Gain-Bandwidth Differential Amplifiers in a Wafer Scale Heterogeneously Integrated Technology Using 250 nm InP DHBTs and 130 nm CMOS von Li, J.C., Elliott, K.R., Matthews, D.S., Hitko, D.A., Zehnder, D., Royter, Y., Patterson, P.R., Hussain, T., Jensen, J.F.

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Integration of Compound Semiconductor Devices and CMOS (CoSMOS) with Die to Wafer Bonding von Patterson, Pamela R., Elliot, Kenneth, Li, James, Royter, Yakov, Hussain, Tahir

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(Invited) Heterogeneous Integration of InP HBTs on CMOS: Leveraging and Providing Value to Conventional Silicon Technologies von Li, James Chingwei, Royter, Yakov, Patterson, Pamela, Hussain, Tahir, Duvall, Janna R., Montes, Mary C., Valles, Irma, Ku, Fiona, Boag-O'Brien, Margaret F., Lopez, Aurelio, Le, Dustin, Zehnder, Daniel, Kim, Samual, Chen, Steven T.W., Oh, Thomas, Akmal, Moonmoon, Wang, Eason F., Hitko, Donald A., Sokolich, Marko, Chow, David H., Brewer, Peter D., Elliott, Kenneth R.

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Reduced temperature S-parameter measurements of 400+ GHz sub-micron InP DHBTs von Li, James Chingwei, Hussain, Tahir, Hitko, Donald A., Royter, Yakov, Fields, Charles H., Milosavljevic, Ivan, Thomas, Stephen, Rajavel, Rajesh D., Asbeck, Peter M., Sokolich, Marko

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InP HBT integrated circuit technology with selectively implanted subcollector and regrown device layers von Sokolich, M., Chen, M.Y., Rajavel, R.D., Chow, D.H., Royter, Y., Thomas, S., Fields, C.H., Binqiang Shi, Bui, S.S., James Chingwei Li, Hitko, D.A., Elliott, K.R.

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High performance InP/InGaAs/InP DHBTs with patterned sub-collector fabricated by elevated temperature N+ implant von Chen, Mary, Sokolich, Marko, Chow, David, Shi, Bin, Rajavel, Rajesh, Bui, Steven, Royter, Yakov, Thomas, Steve, Fields, Charles

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Patterned n+ implant into InP substrate for HBT subcollector von Chen, M.Y., Sokolich, M., Chow, D.H., Bui, S., Royter, Y., Hitko, D., Thomas, S., Fields, C.H., Rajavel, R.D., Biqiang Shi

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100 GHz+ Gain-B andwidth Differential Amplifiers in a Wafer Scale Heterogeneously Integrated Technology Using 250 nm InP DHBTs and 130 nm CMOS von CHINGWEI LI, James, ELLIOTT, Kenneth R, MATTHEWS, David S, HITKO, Donald A, ZEHNDER, Daniel, ROYTER, Yakov, PATTERSON, Pamela R, HUSSAIN, Tahir, JENSEN, Joseph F

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Integrated packaging of over 100 GHz bandwidth uni-traveling-carrier photodiodes von Royter, Y., Furuta, T., Ksdama, S., Sahri, N., Nagatsuma, T., Ishibashi, T.

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Metallic sub-collector for HBT and BJT transistors von Li, James Chingwei, Hitko, Donald A, Patterson, Pamela R, Royter, Yakov

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A 0.8/2.4 GHz Tunable Active Band Pass Filter in InP/Si BiCMOS Technology von Zhiwei Xu, McArdle-Moore, Julia, Oh, Thomas C., Kim, Samuel, Chen, Steven T. W., Royter, Yakov, Lau, Maggy, Valles, Irma, Hitko, Donald A., Li, James C.

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A low power (45mW/latch) static 150GHz CML divider von Hitko, D. A., Hussain, T., Jensen, J. F., Royter, Y., Morton, S. L., Matthews, D. S., Rajavel, R. D., Milosavljevlc, I., Fields, C. H., Thomas, S., Kurdoghllan, A., Lao, Z., Elliott, K., Sokolich, M.

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Heterogeneous integrated circuits and devices thereof with a surrogate substrate and transferred semiconductor devices von Brewer Peter D, Royter Yakov, Hunter Andrew T

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Memristor devices and fabrication von Wang Eason F, Royter Yakov, Wheeler Dana C, Hussain Tahir

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Implantation before epitaxial growth for photonic integrated circuits von IONOV STANISLAV I, ROYTER YAKOV, RAJAVEL RAJESH D

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Method for forming metallic sub-collector for HBT and BJT transistors von Hitko Donald A, Li James Chingwei, Royter Yakov, Patterson Pamela R

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