Self-alignment Ability of Copper Ball on Soldering for Packaging-on-Packaging and Measurement of Oxidation Layer Thickness by Lightness Value von Kawasaki, Hiroyoshi, Hattori, Takahiro, Roppongi, Takahiro, Soma, Daisuke, Sato, Isamu, Kawamata, Yuji, Araki, Koji, Tsuge, Akihiko

Volltext

Improvement of dispersion of pure indium particles by forming indium-complex covering von Kawasaki, Hiroyoshi, Okada, Hiroshi, Roppongi, Takahiro, Soma, Daisuke, Sato, Isamu, Kawamata, Yuji, Araki, Koji, Tsuge, Akihiko

Volltext

Cu balls and Cu-core balls for 3D packaging von Kawasaki, Hiroyoshi, Hattori, Takahiro, Roppongi, Takahiro, Soma, Daisuke, Kawamata, Yuji

Volltext

SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT von KAWASAKI, Hiroyoshi, ROPPONGI Takahiro, SATO Isamu, NISHINO Tomoaki, SOMA Daisuke, HATTORI Takahiro

Volltext bestellen

Soldering material von Sato, Isamu, Nishino, Tomoaki, Kawasaki, Hiroyoshi, Roppongi, Takahiro, Kawamata, Yuji

Volltext bestellen

Coated solder spheres and method for producing the same von SOHMA DAISUKE, ROPPONGI TAKAHIRO

Volltext bestellen

Cu column, Cu core column, solder joint, and through-silicon via von Soma, Daisuke, Sato, Isamu, Kawasaki, Hiroyoshi, Roppongi, Takahiro, Kawamata, Yuji

Volltext bestellen

SOLDER MATERIAL, USE OF SOLDER MATERIAL, AND PRODUCTION METHOD FOR SOLDER MATERIAL von ROPPONGI Takahiro, SATO Isamu, KAWAMATA Yuji, SOMA Daisuke, KAWASAKI Hiroyoshi

Volltext bestellen

CU COLUMN, CU CORE COLUMN, SOLDER JOINT, AND THROUGH-SILICON VIA von ROPPONGI Takahiro, SATO Isamu, KAWAMATA Yuji, SOMA Daisuke, KAWASAKI Hiroyoshi

Volltext bestellen

Cu core ball, solder paste, formed solder, Cu core column, and solder joint von Soma, Daisuke, Sato, Isamu, Roppongi, Takahiro, Hattori, Takahiro

Volltext bestellen

SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER AND SOLDER JOINT von ROPPONGI Takahiro, NISHINO Tomoaki, SATO Isamu, SOMA Daisuke, HATTORI Takahiro, KAWASAKI Hiroyoshi

Volltext bestellen

Solder material, solder paste, and solder joint von Akagawa, Takashi, Okada, Hiroshi, Soma, Daisuke, Yokota, Satoshi, Kawasaki, Hiroyoshi, Munekata, Osamu, Sudo, Hiroki, Roppongi, Takahiro, Takahashi, Hiroshi, Kawanago, Hiroshi

Volltext bestellen

Method of manufacturing cu core ball von Soma, Daisuke, Sato, Isamu, Kawasaki, Hiroyoshi, Roppongi, Takahiro

Volltext bestellen

FLUX von KAWAMATA, Yuji, TAKAHASHI, Atsumi, KAWASAKI, Hiroyoshi, HATTORI, Takahiro, SUDO, Hiroki, ROPPONGI, Takahiro, SOMA, Daisuke, MARUKO, Daisuke, HAGIWARA, Takashi, SATO, Isamu

Volltext bestellen

Solder material, solder paste, solder preform, solder joint and method of managing the solder material von Okada, Hiroshi, Soma, Daisuke, Sato, Isamu, Kawasaki, Hiroyoshi, Roppongi, Takahiro, Hattori, Takahiro

Volltext bestellen

SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT von ROPPONGI Takahiro, NISHINO Tomoaki, SATO Isamu, SOMA Daisuke, HATTORI Takahiro, KAWASAKI Hiroyoshi

Volltext bestellen

COPPER CORE BALL, SOLDER PASTE, FORMED SOLDER, AND SOLDER JOINT von ROPPONGI Takahiro, SATO Isamu, SOMA Daisuke, HATTORI Takahiro

Volltext bestellen

Cu core ball, solder joint, solder paste and formed solder von Kondoh, Shigeki, Soma, Daisuke, Tsuchiya, Masato, Kawasaki, Hiroyoshi, Sudo, Hiroki, Roppongi, Takahiro, Yashima, Takashi

Volltext bestellen

CU-KUGLE, CU-KERNEKUGLE, LODDEFORBINDELSE, LODDEPASTA, OG LODDESKUM von ROPPONGI Takahiro, SATO Isamu, SOMA Daisuke, KAWASAKI Hiroyoshi

Volltext bestellen

SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT von NISHINO, Tomoaki, KAWASAKI, Hiroyoshi, HATTORI, Takahiro, ROPPONGI, Takahiro, SOMA, Daisuke, SATO, Isamu

Volltext bestellen