Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder von Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W.

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Effects of hygrothermal stress on the failure of CFRP composites von Meng, M., Rizvi, M.J., Grove, S.M., Le, H.R.

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Dissolution of electroless Ni metallization by lead-free solder alloys von Sharif, Ahmed, Chan, Y.C., Islam, M.N., Rizvi, M.J.

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Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging von Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N.

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Multi-scale modelling of moisture diffusion coupled with stress distribution in CFRP laminated composites von Meng, M., Rizvi, M.J., Le, H.R., Grove, S.M.

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3D FEA modelling of laminated composites in bending and their failure mechanisms von Meng, M., Le, H.R., Rizvi, M.J., Grove, S.M.

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Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates von RIZVI, M. J, CHAN, Y. C, BAILEY, C, LU, H, ISLAM, M. N, WU, B. Y

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Damage predictions in a chip resistor solder joint on flexible circuit board von Rizvi, M.J., Bailey, C., Lu, H.

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Effect of 9 wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads von Islam, M.N., Chan, Y.C., Sharif, A., Rizvi, M.J.

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The effects of unequal compressive/tensile moduli of composites von Meng, M., Le, H.R., Rizvi, M.J., Grove, S.M.

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Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology von Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y., Pang, C.H.

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The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing von Rizvi, M.J, Chan, Y.C, Bailey, C, Lu, H, Sharif, A

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Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging von RIZVI, M. J, BAILEY, C, CHAN, Y. C, ISLAM, M. N, LU, H

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Study of anisotropic conductive adhesive joint behavior under 3-point bending von Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H.

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Effect of adding 0.3 wt% Ni into the Sn-0.7 wt%Cu solder. Part I: Wetting behavior on Cu and Ni substrates von RIZVI, M. J, BAILEY, C, CHAN, Y. C, LU, H

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Modeling the diffusion of solid copper into liquid solder alloys von Rizvi, M.J., Lu, H., Bailey, C.

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Effect of adding 0.3wt% Ni into the Sn–0.7wt%Cu solder von Rizvi, M.J., Bailey, C., Chan, Y.C., Lu, H.

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Finite element modelling of failures in thick film chip resistor solder joints von Rizvi, M J, Lu, H, Bailey, C, Bevan, E, Pountney, N, Coates, J

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Failure mechanisms of ACF joints under isothermal ageing von Rizvi, M.J., Bailey, C., Lu, H.

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Modelling of jet-impingement cooling for power electronics von Rizvi, M.J., Skuriat, R., Tilford, T., Bailey, C., Johnson, C.M., Lu, H.

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