Ultra-thin chip technology and applications, a new paradigm in silicon technology von Burghartz, Joachim N., Appel, Wolfgang, Harendt, Christine, Rempp, Horst, Richter, Harald, Zimmermann, Martin

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Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips von Endler, S., Ferwana, S., Rempp, H., Harendt, C., Burghartz, J. N.

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Compact modeling of CMOS transistors under variable uniaxial stress von Wacker, Nicoleta, Richter, Harald, Hassan, Mahadi-Ul, Rempp, Horst, Burghartz, Joachim N.

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Compensation of externally applied mechanical stress by stacking of ultrathin chips: Selected Papers from the ESSDERC 2011 Conference von ENDLER, Stefan, REMPP, Horst, HARENDT, Christine, BURGHARTZ, Joachim N

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Compensation of externally applied mechanical stress by stacking of ultra-thin chips von Endler, S., Rempp, H., Harendt, C., Burghartz, J. N.

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Manufacturing aspects of an ultra-thin chip technology von Angelopoulos, E. A., Al-Shahed, M. S., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M., Rempp, H., Zimmermann, M., Burghartz, J. N.

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Experiences on reliability simulation in the framework of the PROPHECY project von Rempp, Horst, Thalau, Oliver, Scorzoni, Andrea, Ghilbaudo, Gerard, Vincent, Emanuel, Minehane, Sean

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Verfahren zur Herstellung einer dreidimensional geformten Maschenware auf einer Flachstrickmaschine von REMPP, WOLFGANG, 7419 SONNENBUEHL, DE, ESSIG, HORST, 7443 FRICKENHAUSEN, DE

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Flat-bed three=dimensional knitting - using needle control to give structured rows between first and final rows which are joined together von REMPP, WOLFGANG, 7419 SONNENBUEHL, DE, ESSIG, HORST, 7443 FRICKENHAUSEN, DE

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