Purification and mechanical nanosizing of Eu-doped GaN von Thomas, Tiju, Guo, Xiaomei, Chandrashekhar, MVS, Poitras, Carl B., Shaff, William, Dreibelbis, Mark, Reiherzer, Jesse, Li, Kewen, DiSalvo, Francis J., Lipson, Michal, Spencer, M.G.

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The Last Missing Member of the AE2[BN2]Cl Series – Synthesis, Structural and Spectroscopic Characterization of Ba2[BN2]Cl von Reckeweg, Olaf, Reiherzer, Jesse, Schulz, Armin, DiSalvo, Francis J.

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INTEGRATED RADIO FREQUENCY POWERED LIGHT EMITTING DIODE CHIPS AND FABRICATION METHODS von Blakely, Colin, Reiherzer, Jesse, Check, Michael

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Effect of growth temperature on Eu incorporation in GaN powders von Shi, Junxia, Chandrashekhar, M.V.S., Reiherzer, Jesse, Schaff, William J., Lu, Jie, Disalvo, Francis J., Spencer, Michael G.

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Light emitting diodes, components and related methods von Andrews, Peter Scott, Abare, Amber C, Reiherzer, Jesse Colin

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The Last Missing Member of the AE 2 [BN 2 ]Cl Series – Synthesis, Structural and Spectroscopic Characterization of Ba 2 [BN 2 ]Cl von Reckeweg, Olaf, Reiherzer, Jesse, Schulz, Armin, DiSalvo, Francis J.

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Lighting device including multiple wavelength conversion material layers von REIHERZER JESSE

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Lighting device including multiple encapsulant material layers von REIHERZER JESSE

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LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS von ABARE, Amber, C, ANDREWS, Peter, Scott, REIHERZER, Jesse, Colin

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High intensity red emission from Eu doped GaN powders von Shi, Junxia, Chandrashekhar, M. V. S., Reiherzer, Jesse, Schaff, William, Lu, Jie, Disalvo, Francis, Spencer, Michael

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LED package with multiple element light source and encapsulant having curved and/or planar surfaces von Pun, Arthur, Clark, Joseph, Nevins, Jeremy, Reiherzer, Jesse

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LIGHTING DEVICE INCLUDING MULTIPLE WAVELENGTH CONVERSION MATERIAL LAYERS von REIHERZER JESSE

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LIGHTING DEVICE INCLUDING MULTIPLE ENCAPSULANT MATERIAL LAYERS von REIHERZER JESSE

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WAFER LEVEL FABRICATION FOR MULTIPLE CHIP LIGHT-EMITTING DEVICES von Wuester, Steven, Blakely, Colin, Celano, Thomas, Reiherzer, Jesse, Suich, David, Check, Michael

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WAFER LEVEL FABRICATION FOR MULTIPLE CHIP LIGHT-EMITTING DEVICES von CHECK, Michael, CELANO, Thomas, SUICH, David, REIHERZER, Jesse, BLAKELY, Colin, WUESTER, Steven

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LED package von Clark, Joseph, Nevins, Jeremy, Reiherzer, Jesse

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INTERCONNECT STRUCTURES FOR IMPROVED LIGHT-EMITTING DIODE CHIP PERFORMANCE von Wuester, Steven, White, Justin, Blakely, Colin, Haberern, Kevin, Reiherzer, Jesse, Check, Michael

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INTERCONNECT STRUCTURES FOR IMPROVED LIGHT-EMITTING DIODE CHIP PERFORMANCE von CHECK, Michael, REIHERZER, Jesse, BLAKELY, Colin, WUESTER, Steven, WHITE, Justin, HABERERN, Kevin

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CURRENT SPREADING LAYER STRUCTURES FOR LIGHT-EMITTING DIODE CHIPS von CHECK, Michael, REIHERZER, Jesse, BLAKELY, Colin, WUESTER, Steven, WHITE, Justin, HABERERN, Kevin

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CURRENT SPREADING LAYER STRUCTURES FOR LIGHT-EMITTING DIODE CHIPS von Wuester, Steven, White, Justin, Blakely, Colin, Haberern, Kevin, Reiherzer, Jesse, Check, Michael

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