White-matter changes correlate with cognitive functioning in Parkinson's disease von Theilmann, Rebecca J, Reed, Jason D, Song, David D, Huang, Mingxiong X, Lee, Roland R, Litvan, Irene, Harrington, Deborah L

Volltext

Volumetric correlates of cognitive functioning in nondemented patients with Parkinson's disease von Filoteo, J. Vincent, Reed, Jason D., Litvan, Irene, Harrington, Deborah L.

Volltext

Neural underpinnings of distortions in the experience of time across senses von Harrington, Deborah L, Castillo, Gabriel N, Fong, Christopher H, Reed, Jason D

Volltext

High Density Metal-Metal Interconnect Bonding for 3-D Integration von Lannon, J. M., Gregory, C., Lueck, M., Reed, J. D., Huffman, C. A., Temple, D.

Volltext

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn-Cu Bonding for Three-Dimensional Integrated Circuits von Lueck, M. R., Reed, J. D., Gregory, C. W., Huffman, A., Lannon, J. M., Temple, D. S.

Volltext

Swaziland HIV Incidence Measurement Survey (SHIMS): a prospective national cohort study von Justman, Jessica, Dr, Reed, Jason B, MD, Bicego, George, PhD, Donnell, Deborah, PhD, Li, Keala, MS, Bock, Naomi, MD, Koler, Alison, MPH, Philip, Neena M, MPH, Mlambo, Charmaine K, PhD, Parekh, Bharat S, PhD, Duong, Yen T, PhD, Ellenberger, Dennis L, PhD, El-Sadr, Wafaa M, Prof, Nkambule, Rejoice, MPH

Volltext

Reliability and ultra-low temperature bonding of high density large area arrays with Cu/Sn-Cu interconnects for 3D integration von Reed, Jason D, Lueck, Matthew, Gregory, Chris, Huffman, Charles A, Lannon, John M, Temple, Dorota

Volltext

THERMOELECTRIC HEAT PUMP CASCADE USING MULTIPLE PRINTED CIRCUIT BOARDS WITH THERMOELECTRIC MODULES von SCHNEIDER, Kevin S, NEWMAN, Devon, WILLIAMS, Brian J, YADAV, Abhishek, EDWARDS, Jesse W, REED, Jason D

Volltext bestellen

THERMOELECTRIC HEAT PUMP CASCADE USING MULTIPLE PRINTED CIRCUIT BOARDS WITH THERMOELECTRIC MODULES von SCHNEIDER, Kevin S, NEWMAN, Devon, WILLIAMS, Brian J, YADAV, Abhishek, EDWARDS, Jesse W, REED, Jason D

Volltext bestellen

THERMOELECTRIC HEAT PUMP CASCADE USING MULTIPLE PRINTED CIRCUIT BOARDS WITH THERMOELECTRIC MODULES von Reed, Jason D, Schneider, Kevin S, Yadav, Abhishek, Newman, Devon, Williams, Brian J, Edwards, Jesse W

Volltext bestellen

Multi header for thermoelectric device von Reed, Jason D, Therrien, Robert J, Newman, Devon, Edwards, Jesse W, Schneider, Kevin Shawne, Williams, Brian, Prejs, Arthur, Guichard, Alex R

Volltext bestellen

CORROSION RESISTANT THERMOELECTRIC DEVICES von THERRIEN, Robert Joseph, OSWALT, Kevin, BIKKY, Rajesh, CANTU, Pablo, UPADHAYAY, Swathi, REED, Jason D, NARAYANAN, Ananthakrishnan, GUICHARD, Alex R, SEEL, Steven Craig, HENDERSON, Brooks

Volltext bestellen

Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterizatio... von Reed, J D, Goodwin, S, Gregory, C, Temple, D

Volltext bestellen

Measurement of nonuniform distribution of strain in InGaAs/GaAs quantum wires von Chen, Yu-Pei, Reed, Jason D., Schaff, William J., Eastman, Lester F.

Volltext

MULTI HEADER FOR THERMOELECTRIC DEVICE von Therrien Robert J, Schneider Kevin Shawne, Edwards Jesse W, Newman Devon, Prejs Arthur, Williams Brian, Guichard Alex R, Reed Jason D

Volltext bestellen

Low resistivity ohmic contact von HESS RONALD R, GRAY ALLEN L, REED JASON D, PREJS ARTHUR, WELLENIUS IAN PATRICK, RUMSEY JAIME A

Volltext bestellen

LOW RESISTIVITY CONTACT von RUMSEY, JAIME, A, THERRIEN, ROBERT, JOSEPH, REED, JASON, D, GRAY, ALLEN, L

Volltext bestellen

High resolution acoustical imaging of high-density-interconnects for 3D-integration von Brand, Sebastian, Petzold, Matthias, Czurratis, Peter, Reed, Jason D., Lueck, Matthew, Gregory, Chris, Huffman, Alan, Lannon, John M., Temple, Dorota S.

Volltext

THERMOELECTRIC HEAT PUMP CASCADE USING MULTIPLE PRINTED CIRCUIT BOARDS WITH THERMOELECTRIC MODULES von WILLIAMS BRIAN J, SCHNEIDER KEVIN S, REED JASON D, YADAV ABHISHEK, NEWMAN DEVON, EDWARDS JESSE W

Volltext bestellen

High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration von Reed, Jason D, Lueck, Matthew, Gregory, Chris, Huffman, Alan, Lannon, John M, Temple, Dorota

Volltext