Synthetic gecko foot-hairs from multiwalled carbon nanotubes von Yurdumakan, Betul, Raravikar, Nachiket R, Ajayan, Pulickel M, Dhinojwala, Ali

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Embedded Carbon-Nanotube-Stiffened Polymer Surfaces von Raravikar, Nachiket R., Vijayaraghavan, Aravind S., Keblinski, Pawel, Schadler, Linda S., Ajayan, Pulickel M.

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Embedded Carbon -Nanotube-Stiffened Polymer Surfaces von Raravikar, Nachiket R, Vijayaraghavan, Aravind S, Keblinski, Pawel, Schadler, Linda S, Ajayan, Pulickel M

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Methods of utilizing low temperature solder assisted mounting techniques for package structures von Raravikar, Nachiket R, Sane, Sandeep B, Karhade, Omkar G

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Semiconductor package with electromagnetic interference shielding von Dias, Rajendra C, Raravikar, Nachiket R

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SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING von Dias, Rajendra C, Raravikar, Nachiket R

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Varied ball ball-grid-array (BGA) packages von Lu, Jiongxin, Combs, Christopher, Raravikar, Nachiket R, Lu, Xiao, Malatkar, Pramod, Harper, John, Klein, Steven A, Sood, Mohit, Zhang, Jieping, Huettis, Alexander, Deppisch, Carl

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LPS solder paste based low cost fine pitch pop interconnect solutions von Mathkar, Akshay, Raravikar, Nachiket R, Matayabas, Jr., James C

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HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Heat spreader edge standoffs for managing bondline thickness in microelectronic packages von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Integrated microelectronic package temperature sensor von PATEL NEHA, RARAVIKAR NACHIKET R

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Computing system with a thermal interface comprising magnetic particles von Raravikar, Nachiket R, Sahasrabudhe, Shubhada H, Limaye, Ameya

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COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTICLES von Raravikar, Nachiket R, Sahasrabudhe, Shubhada H, Limaye, Ameya

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INTEGRATED MICROELECTRONIC PACKAGE TEMPERATURE SENSOR von NEHA PATEL, NACHIKET R. RARAVIKAR

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Method and materials for warpage thermal and interconnect solutions von Deshpande, Nitin A, Raravikar, Nachiket R, Karhade, Omkar G, Vaidya, Aditya S, Li, Eric J

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Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging von Choudhury, Arnab, Raravikar, Nachiket R, Malatkar, Pramod, Muthur Srinath, Purushotham Kaushik, Jha, Chandra M, Agraharam, Sairam

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Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same von PANAT RAHUL, RARAVIKAR NACHIKET R

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Sintered solder for fine pitch first-level interconnect (FLI) applications von Subramanian, Vijay Krishnan (Vijay), Raravikar, Nachiket R, Patel, Neha M, Oka, Mihir A, Hackenberg, Ken P

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VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES von LU, JIONGXIN, COMBS, CHRISTOPHER, ZHANG, JIEPING, DEPPISCH, CARL, RARAVIKAR, NACHIKET R, KLEIN, STEVEN A, HUETTIS, ALEXANDER, HARPER, JOHN, MALATKAR, PRAMOD, SOOD, MOHIT, LU, XIAO

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SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLICATIONS von SUBRAMANIAN, Vijay Krishnan (Vijay), PATEL, Neha M, RARAVIKAR, Nachiket R, HACKENBERG, Ken P, OKA, Mihir A

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