Treffer 1 - 15 von 15 für Suche 'RAMALEKSHMI THANU, Dinesh Padmanabhan', Suchdauer: 0,56s Treffer weiter einschränken
  1. 1
    Effect of Water Addition to Choline Chloride―Urea Deep Eutectic Solvent (DES) on the Removal of Post-Etch Residues Formed on Copper

    Effect of Water Addition to Choline Chloride―Urea Deep Eutectic Solvent (DES) on the Removal of Post-Etch Residues Formed on Copper von RAMALEKSHMI THANU, Dinesh Padmanabhan, RAGHAVAN, Srini, KESWANI, Manish


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  2. 2
    Effect of Water Addition to Choline Chloride-Urea Deep Eutectic Solvent (DES) on the Removal of Post-Etch Resid ues Formed on Copper

    Effect of Water Addition to Choline Chloride-Urea Deep Eutectic Solvent (DES) on the Removal of Post-Etch Resid ues Formed on Copper von Thanu, Dinesh Padmanabhan Ramalekshmi, Raghavan, Srini, Keswani, Manish


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  3. 3
    Dilute HF Solutions for Copper Cleaning during BEOL Processes: Effect of Aeration on Selectivity and Copper Corrosion

    Dilute HF Solutions for Copper Cleaning during BEOL Processes: Effect of Aeration on Selectivity and Copper Corrosion von Padmanabhan Ramalekshmi Thanu, Dinesh, Venkataraman, Nandini, Raghavan, Srini, Mahdavi, Omid


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  4. 4
    SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE

    SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE von Zhang, Rui, Ayalasomayajula, Mukund, Lu, Xiao, Stover, Patrick Neel, Padmanabhan Ramalekshmi Thanu, Dinesh, Nickerson, Robert

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  5. 5
    Substrate integrated posts and heat spreader customization for enhanced package thermomechanics

    Substrate integrated posts and heat spreader customization for enhanced package thermomechanics von Eid, Feras, Padmanabhan Ramalekshmi Thanu, Dinesh, Beatty, John J, Chan Arguedas, Sergio, Swan, Johanna M

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  6. 6
    Semiconductor package having sealant bridge

    Semiconductor package having sealant bridge von Li, Peng, Garner, Luke J, An, Yonghao, Cartas Ayala, Marco Aurelio, Dhavaleswarapu, Hemanth K, Padmanabhan Ramalekshmi Thanu, Dinesh, Beatty, John J, Guthikonda, Venkata Suresh

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  7. 7
    SUBSTRATE INTEGRATED POSTS AND HEAT SPREADER CUSTOMIZATION FOR ENHANCED PACKAGE THERMOMECHANICS

    SUBSTRATE INTEGRATED POSTS AND HEAT SPREADER CUSTOMIZATION FOR ENHANCED PACKAGE THERMOMECHANICS von CHAN ARGUEDAS, Sergio, SWAN, Johanna M, EID, Feras, PADMANABHAN RAMALEKSHMI THANU, Dinesh, BEATTY, John J

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  8. 8
    THERMAL INTERFACE STRUCTURE HAVING AN EDGE STRUCTURE AND A THERMAL INTERFACE MATERIAL

    THERMAL INTERFACE STRUCTURE HAVING AN EDGE STRUCTURE AND A THERMAL INTERFACE MATERIAL von RAORANE, Digvijay A, CHAN ARGUEDAS, Sergio A, EID, Feras, CHENEY, Robert F, PADMANABHAN RAMALEKSHMI THANU, Dinesh

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  9. 9
    SUBSTRATE INTEGRATED POSTS AND HEAT SPREADER CUSTOMIZATION FOR ENHANCED PACKAGE THERMOMECHANICS

    SUBSTRATE INTEGRATED POSTS AND HEAT SPREADER CUSTOMIZATION FOR ENHANCED PACKAGE THERMOMECHANICS von SWAN, Johanna M, CHAN ARGUEDAS, Sergio A, PADMANABHAN RAMALEKSHMI THANU, Dinesh, EDI, Feras, BEATTY, John J

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  10. 10
    LÖTGITTERANORDNUNG ZUR ANBRINGUNG EINES DIE-GEHÄUSES

    LÖTGITTERANORDNUNG ZUR ANBRINGUNG EINES DIE-GEHÄUSES von Zhang, Rui, Ayalasomayajula, Mukund, Lu, Xiao, Padmanabhan Ramalekshmi Thanu, Dinesh, Nickerson, Robert, Neel Stover, Patrick

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  11. 11
    SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE

    SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE von GUTHIKONDA, Venkata Suresh, CARTAS AYALA, Marco Aurelio, AN, Yonghao, LI, Peng, GARNER, Luke J, PADMANABHAN RAMALEKSHMI THANU, Dinesh, DHAVALESWARAPU, Hemanth K, BEATTY, John J

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  12. 12
    COOLING SOLUTION DESIGNS FOR MICROELECTRONIC PACKAGES

    COOLING SOLUTION DESIGNS FOR MICROELECTRONIC PACKAGES von Garner, Luke J, Padmanabhan Ramalekshmi Thanu, Dinesh, Bicen, Baris, Dhavaleswarapu, Hemanth, Hu, Wei, Matayabas, JR., James C

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  13. 13
    SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE

    SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE von GUTHIKONDA, Venkata Suresh, AN, Yonghao, PENG, Li, GARNER, Luke J, DHAVALESWARAPU, Hemanth K, BEATTY, John J, AYALA, Marco Aurelio Cartas, THANU, Dinesh Padmanabhan Ramalekshmi

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  14. 14
    Dilute HF Solutions for Copper Cleaning during BEOL Processes: Effect of Aeration on Selectivity and Copper Corrosion

    Dilute HF Solutions for Copper Cleaning during BEOL Processes: Effect of Aeration on Selectivity and Copper Corrosion von Padmanabhan Ramalekshmi Thanu, Dinesh, Venkataraman, Nandini, Raghavan, Srini, Mahdavi, Omid


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  15. 15
    BENIGN, LIQUID CHEMICAL SYSTEM-BASED BACK END OF LINE (BEOL) CLEANING

    BENIGN, LIQUID CHEMICAL SYSTEM-BASED BACK END OF LINE (BEOL) CLEANING von THANU DINESH PADMANABHAN RAMALEKSHMI, RAGHAVAN SRINI, KESWANI MANISH K

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