A note on the critical points of the localization landscape von Lundberg, Erik, Ramachandran, Koushik

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Number of components of polynomial lemniscates: A problem of Erdös, Herzog, and Piranian von Ghosh, Subhajit, Ramachandran, Koushik

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Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications von Demir, Kaya, Sukumaran, Vijay, Sato, Yoichiro, El Amrani, Abderrahim, Ramachandran, Koushik, Pucha, Raghuram, Markondeya Raj, P., Sundaram, Venkatesh, Tummala, Rao

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Random Bernstein–Markov factors von Pritsker, Igor, Ramachandran, Koushik

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Equidistribution of zeros of random polynomials von Pritsker, Igor, Ramachandran, Koushik

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Inradius of random lemniscates von Krishnapur, Manjunath, Lundberg, Erik, Ramachandran, Koushik

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The arc length and topology of a random lemniscate von Lundberg, Erik, Ramachandran, Koushik

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Harnack Inequality for Non-Local Schrödinger Operators von Athreya, Siva, Ramachandran, Koushik

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The arc length and topology of a random lemniscate: RANDOM LEMNISCATES von Lundberg, Erik, Ramachandran, Koushik

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Asymptotic Behavior of Positive Harmonic Functions in Certain Unbounded Domains von Ramachandran, Koushik

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Natural Boundary and Zero Distribution of Random Polynomials in Smooth Domains von Pritsker, Igor, Ramachandran, Koushik

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3D Integrated Laser Attach Technology on a 300-mm Monolithic CMOS Silicon Photonics Platform von Bian, Yusheng, Ramachandran, Koushik, Wu, Zhuo-Jie, Hedrick, Brittany, Dezfulian, Kevin K., Houghton, Thomas, Nummy, Karen, Fisher, Daniel, Hirokawa, Takako, Donegan, Keith, Afzal, Francis O, Esopi, Monica, Karra, Vaishnavi, Lee, Won Suk, Sorbara, Massimo, Lubguban, Jorge, Cho, Jae Kyu, Cao, Rongtao, Ding, Hanyi, Chandran, Sujith, Rakowski, Michal, Aboketaf, Abdelsalam, Krishnamurthy, Subramanian, Mills, Scott, Peng, Bo, Pepper, Jeff, Deka, Suruj, Feng, Wen, Rishton, Steven, Boudreau, Marcel, Logan, Dylan, Hickey, Ryan, Gomes, Prova Christina, Murray, Kyle, Dewanjee, Arnab, Riggs, Dave, Robson, Norman, Melville, Ian, Augur, Rod, Fox, Robert, Gupta, Vikas, Yu, Anthony, Giewont, Ken, Pellerin, John, Letavic, Ted

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Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon von Sukumaran, Vijay, Kumar, Gokul, Ramachandran, Koushik, Suzuki, Yuya, Demir, Kaya, Sato, Yoichiro, Seki, Toshitake, Sundaram, Venky, Tummala, R. R.

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Number of components of polynomial lemniscates: a problem of Erd\"os, Herzog, and Piranian von Ghosh, Subhajit, Ramachandran, Koushik

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Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates von Ramachandran, Koushik, Liu, Fuhan, Raj, P. Markondeya, Sundaram, Venky, Tummala, Rao

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A note on the critical points of the localization landscape von Lundberg, Erik, Ramachandran, Koushik

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Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates: Pb-free Solders and Materials for Emerging Interconnect and Packaging... von RAMACHANDRAN, Koushik, FUHAN LIU, MARKONDEYA RAJ, P, SUNDARAM, Venky, TUMMALA, Rao

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Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy von Ramachandran, Koushik, Pruyn, Timothy L., Huang, Timothy, Wang, Yushu, Singh, Preet M., Jud Ready, W., Gerhardt, Rosario A., Sundaram, Venky, Tummala, Rao

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Number of components of polynomial lemniscates: a problem of Erdös, Herzog, and Piranian von Ghosh, Subhajit, Ramachandran, Koushik

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Inradius of random lemniscates von Krishnapur, Manjunath, Lundberg, Erik, Ramachandran, Koushik

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