Study of copper thick film metallization on aluminum nitride von Hlina, Jiri, Reboun, Jan, Hamacek, Ales

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FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers von Kalaš, David, Šíma, Karel, Kadlec, Petr, Polanský, Radek, Soukup, Radek, Řeboun, Jan, Hamáček, Aleš

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Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials von Kalaš, David, Soukup, Radek, Řeboun, Jan, Radouchová, Michaela, Rous, Pavel, Hamáček, Aleš

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Properties of power electronic substrates based on thick printed copper technology von Reboun, Jan, Hromadka, Karel, Hermansky, Vojtech, Johan, Jan

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Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons von Hirman, Martin, Navratil, Jiri, Steiner, Frantisek, Reboun, Jan, Soukup, Radek, Hamacek, Ales

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Effect of copper- and silver-based films on alumina substrate electrical properties von Reboun, Jan, Hlina, Jiri, Totzauer, Pavel, Hamacek, Ales

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Solder joints on thick printed copper substrates von Hirman, Martin, Michal, David, Reboun, Jan, Steiner, Frantisek

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Interconnecting embroidered hybrid conductive yarns by ultrasonic plastic welding for e-textiles von Dils, Christian, Kalas, David, Reboun, Jan, Suchy, Stanislav, Soukup, Radek, Moravcova, Daniela, Krshiwoblozki, Malte von, Schneider-Ramelow, Martin

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Investigation of cooling capability of ceramic substrates for power electronics applications von Hlina, Jiri, Reboun, Jan, Janda, Martin

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Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications von Hlina, Jiri, Reboun, Jan, Hamacek, Ales

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Study of Internal Stress in Conductive and Dielectric Thick Films von Hlina, Jiri, Reboun, Jan, Janda, Martin, Hamacek, Ales

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Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper von Hlina, Jiri, Reboun, Jan, Simonovsky, Marek, Syrovy, Tomas, Janda, Martin, Hamacek, Ales

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Microstrip resonators on polyethylene terephthalate substrates realized by direct-write technology von Lotfi, Saeedeh, Janda, Martin, Reboun, Jan, Blecha, Tomas

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Reliability of printed power resistor with thick-film copper terminals von Hlina, Jiri, Reboun, Jan, Johan, Jan, Simonovsky, Marek, Hamacek, Ales

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Study of co-fired multilayer structures based on Thick Printed Copper technology von Hlina, Jiri, Reboun, Jan, Hermansky, Vojtech, Simonovsky, Marek, Johan, Jan, Hamacek, Ales

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Test bench for calibration of magnetic field sensor prototypes for COMPASS-U tokamak von Torres, Andre, Kovarik, Karel, Markovic, Tomas, Adamek, Jiri, Duran, Ivan, Ellis, Robert, Jerab, Martin, Reboun, Jan, Turjanica, Pavel, Weinzettl, Vladimir, Fernandes, Horacio

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Characterization of the organic field-effect transistor based on solution processed P3HT von Pretl, S, Kroupa, M, Hamáček, Aleš, Džugan, Tomáš, Řeboun, Jan, Čengery, Jiří

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Development of the diagnostic tools for the COMPASS-U tokamak and plans for the first plasma von Weinzettl, Vladimir, Bilkova, Petra, Duran, Ivan, Hron, Martin, Panek, Radomir, Markovic, Tomas, Varavin, Mykyta, Cavalier, Jordan, Kovarik, Karel, Torres, André, Matveeva, Ekaterina, Böhm, Petr, Ficker, Ondrej, Horacek, Jan, Cerovsky, Jaroslav, Zajac, Jaromir, Adamek, Jiri, Dimitrova, Miglena, Imrisek, Martin, Sos, Miroslav, Tomesova, Eva, Vondracek, Petr, Mikszuta-Michalik, Katarzyna, Svoboda, Jakub, Naydenkova, Diana, Bogar, Klara, Caloud, Jakub, Ivanov, Vladislav, Lukes, Samuel, Podolnik, Ales, Bogar, Ondrej, Entler, Slavomir, Havranek, Ales, Preinhaelter, Josef, Jaulmes, Fabien, Dejarnac, Renaud, Balner, Vojtech, Veselovsky, Viktor, Belina, Pavel, Kral, Miroslav, Gerardin, Jonathan, Vlcek, Jiri, Tadros, Momtaz, Turjanica, Pavel, Kindl, Vladimir, Reboun, Jan, Rowan, William, Houshmandyar, Saeid, Scholz, Marek, Bielecki, Jakub, Makowski, Dariusz, Chernyshova, Maryna, Cipciar, Dario

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Sensitivity of Organic Humidity Sensor Element on Organic Vapours von Dzugan, Tomas, Kroupa, Michael, Reboun, Jan

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A power module for a semiconductor circuit breaker von Řeboun, Jan, Peroutka, Zdeněk, Jára, Martin

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