Behavior of intermetallics formation and evolution in Ag–8Au–3Pd alloy wire bonds von Guo, Rui, Hang, Tao, Mao, Dali, Li, Ming, Qian, Kaiyou, Lv, Zhong, Chiu, Hope

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Synthesis studies of sputtering TiO2 films on poly(dimethylsiloxane) for surface modification von Niu, Zhiqiang, Gao, Feng, Jia, Xiaoyu, Zhang, Weiping, Chen, Wenyuan, Qian, KaiYou

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Reactive sputtering TiO2 films for surface coating of poly(dimethylsiloxane) von Niu, Zhiqiang, Jia, Xiaoyu, Zhang, Weiping, Chen, Wenyuan, Qian, KaiYou

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Electrodeposited Ni microcones with a thin Au film bonded with Au wire von Gao, Shixin, Chen, Zhuo, Hu, Anmin, Li, Ming, Qian, Kaiyou

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Simulation and fabrication of carbon nanotubes field emission pressure sensors von Qian, Kaiyou, Chen, Ting, Yan, Bingyong, Lin, Yangkui, Xu, Dong, Sun, Zhuo, Cai, Bingchu

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Effects of argon plasma treating on surface morphology and gas ionization property of carbon nanotubes von Yan, Bingyong, Qian, Kaiyou, Zhang, Yafei, Xu, Dong

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Microstructure evolution of Ag–8Au–3Pd alloy wire during electromigration von Guo, Rui, Gao, Liming, Li, Ming, Mao, Dali, Qian, Kaiyou, Chiu, Hope

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Studies on vacuum microelectronic pressure sensors based on carbon nanotubes arrays von Qian, Kaiyou, Chen, Ting, Yan, Bingyong, Lin, Yangkui, Xu, Dong, Sun, Zhuo, Cai, Bingchu

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Reactive sputtering TiO 2 films for surface coating of poly(dimethylsiloxane) von Niu, Zhiqiang, Jia, Xiaoyu, Zhang, Weiping, Chen, Wenyuan, Qian, KaiYou

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CHIP PACKAGING STRUCTURE, ELECTRONIC DEVICE AND CHIP PACKAGING METHOD von HUANG, SHIH-YUEH, QIAN, Kaiyou

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Behaviors of palladium in palladium coated copper wire bonding process von Binhai Zhang, Kaiyou Qian, Wang, T., Yuqi Cong, Zhao, M., Xiangquan Fan, Jiaji Wang

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PACKAGE HEAT DISSIPATION COVER AND PACKAGE STRUCTURE von XUE, Yuting, QIAN, Kaiyou

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Chip packaging structure and electronic equipment von QIAN KAIYOU, XUE YUTING

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Synthesis studies of sputtering TiO 2 films on poly(dimethylsiloxane) for surface modification von Niu, Zhiqiang, Gao, Feng, Jia, Xiaoyu, Zhang, Weiping, Chen, Wenyuan, Qian, KaiYou

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Chip packaging structure, electronic equipment and chip packaging method von QIAN KAIYOU, HUANG SHIYUE

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Nanoindentation investigation of copper bonding wire and ball von Xiangquan Fan, Kaiyou Qian, Techun Wang, Yuqi Cong, Zhao, M., Binhai Zhang, Jiaji Wang

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Packaging heat dissipation cover and packaging structure von QIAN KAIYOU, XUE YUTING

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Semiconductor packaging structure von QIAN KAIYOU, HUANG SHENGHUA, PENG BINGGUO

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Semiconductor packaging structure von QIAN KAIYOU, QIN RUIFENG, HUANG SHENGHUA, HUANG SHIYUE

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Semiconductor device including electromagnetic absorption and shielding von Bai, Ye, Chiu, Chin-Tien, Qian, Kaiyou, Huang, Dacheng

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