Effect of Cu-P-Sn on brazing diamond with Ni-based filler alloy von Lu, Jinbin, Qi, Wenchun, Zhang, Wangxi, Li, Yang, Qi, Fangjuan, Zhong, Sujuan, Xu, Shuai

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Evolution of residual stress field in 6N01 aluminum alloy friction stir welding joint von Liu Jialun, Zhu Hao, Jiang Yue, Qi Fangjuan, Wang Jun

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Mechanical properties and fracture behaviors on 6061 aluminum alloy under shear stress state von Zhu, Hao, Qi, Fangjuan

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Effects of antimony addition on the microstructures of ZA84 magnesium alloy von Wang, Jianqiang, Ding, Zhanlai, Qi, Fangjuan, Zhu, Hao, Fan, Yunchang

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Evolution of interface carbide diamond brazed with filler alloy containing Cr von Lu, Jinbin, Cao, Ziyang, Qi, Fangjuan, Qian, Mi, Zhang, Wangxi

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Effect of hydrogen on the microstructure and mechanical properties of high temperature deformation of Ti6Al4V additive manufactured von Qi, Fangjuan, Yao, Jiachen, Dai, Guoqing, Chen, Xiaolong, Guo, Yanhua, Sun, Zhonggang, Wang, Yaoqi, Liu, Hongbing

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The effect of hydrogen on the grain refinement and mechanisms for Ti6Al4V alloys during laser melting deposition von Sun, Zhonggang, Qi, Fangjuan, Guo, Yanhua, Wang, Yaoqi, Chang, Hui, Wu, Fan, Chen, Wei, Ji, Xiao

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Preparation of ITO Nanoparticles by Liquid Phase Coprecipitation Method von Ding, Zhanlai, An, Cunran, Li, Qiang, Hou, Zhezhe, Wang, Jianqiang, Qi, Haibo, Qi, Fangjuan

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Analysis on brazed diamond joints with modified Cu-based filler alloy von Lu, Jinbin, Qi, Wenchun, Li, Yang, Qi, Fangjuan, Qian, Mi, Qiu, Xinkai

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Mechanical bend fatigue reliability of lead-free and halogen-free PBGA assemblies von Jonnalagadda, K., Fangjuan Qi, Liu, J.

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Effect of Local Laser Surfacing on the Fatigue Crack Propagation Rate of Al-alloy 6056 and its Laser Beam Weld von Qi, Fangjuan, Staron, Peter, Ventzke, V.

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Experimental Studies on J-Integral of Welded Buried High-Density Polyethylene Pipes von Li, Jian, Fang, Min, Yang, Zhi Juan, Qi, Fang Juan

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The Effect of Nano-Cu Particles on Mechanical Properties of Micro-Joining Joint with Lead-Free Solder von Qi, Fang Juan, Shen, Ying Ming, Li, Jian, Xie, Min

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Preparation of ITO Nanoparticles by Liquid Phase Coprecipitation Method von Ding, Zhanlai, An, Cunran, Li, Qiang, Hou, Zhezhe, Wang, Jianqiang, Qi, Haibo, Qi, Fangjuan

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Numerical Simulation of Welding Temperature Field on Side Beam of Train Bogie von Ren, De Liang, Yu, Shen Wei, Qi, Fang Juan, Fang, Min, Li, Jian, Guo, Hao

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The effects of Ni nanoparticles addition on shear behavior and microstructure of Sn-Ag Lead-free solder von Fangjuan Qi, Li Sun, Zhezhe Hou, Jianqiang Wang, Cha Qin

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The Effect of Reflow Time on Intermetallic Compound in Lead-Free Micro-Joining Joint von Yaping Ding, Fangjuan Qi, Changling Xu, Hulin Dong

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The Effect of Aging on Microstructures Evolution and Shear Behaviors in Lead-free Solder Joint von Minghui Yang, Fangjuan Qi, Yaping Ding, Deliang Ren, Changling Xu

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Study on the Mechanical Bend Fatigue of Micro-Joining Soldered Joint with Lead-Free Solder von Qi, Fang Juan, Ding, Ya Ping, Huo, Li Xing, Ding, Zhan Lai

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Research on failure modes of BGA assemblies with lead-free solder on different PCB materials von Fangjuan Qi, Jim Liu

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