Application of the Protection/Deprotection Strategy to the Science of Porous Materials von Frot, Theo, Volksen, Willi, Purushothaman, Sampath, Bruce, Robert, Dubois, Geraud

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Atomic-beam alignment of inorganic materials for liquid-crystal displays von Chaudhari, P, Lacey, James, Doyle, James, Galligan, Eileen, Lien, Shui-Chi Alan, Callegari, Alesandro, Hougham, Gareth, Lang, Norton D, Andry, Paul S, John, Richard, Yang, Kei-Hsuing, Lu, Minhua, Cai, Chen, Speidell, James, Purushothaman, Sampath, Ritsko, John, Samant, Mahesh, Stöhr, Joachim, Nakagawa, Yoshiki, Katoh, Yoshimine, Saitoh, Yukito, Sakai, Kazumi, Satoh, Hiroyuki, Odahara, Shuichi, Nakano, Hiroki, Nakagaki, Johji, Shiota, Yasuhiko

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Post Porosity Plasma Protection: Scaling of Efficiency with Porosity von Frot, Theo, Volksen, Willi, Purushothaman, Sampath, Bruce, Robert L., Magbitang, Teddie, Miller, Dolores C., Deline, Vaughn R., Dubois, Geraud

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High-performance bottom electrode organic thin-film transistors von Kymissis, I., Dimitrakopoulos, C.D., Purushothaman, S.

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A Manufacturing Grade, Porous Oxycarbosilane Spin-On Dielectric Candidate with K ≤ 2.0 von Volksen, Willi, Magbitang, Teddie P., Miller, Robert D., Purushothaman, Sampath, Cohen, Stephan A., Nakagawa, Hisashi, Nobe, Youhei, Kokubo, Terukazu, Dubois, Geraud J. M.

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Low-Voltage, High-Mobility Pentacene Transistors with Solution-Processed High Dielectric Constant Insulators von Dimitrakopoulos, C. D., Kymissis, I., Purushothaman, S., Neumayer, D. A., Duncombe, P. R., Laibowitz, R. B.

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Field-effect transistors comprising molecular beam deposited α,ω-di-hexyl-hexathienylene and polymeric insulator von Dimitrakopoulos, Christos D., Furman, Bruce K., Graham, Teresita, Hegde, Suryanarayan, Purushothaman, Sampath

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Patterning pentacene organic thin film transistors von Kymissis, Ioannis, Dimitrakopoulos, Christos D., Purushothaman, Sampath

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Integration of a Manufacturing Grade, k = 2.0 Spin-On Material in a Single Damascene Structure von Volksen, Willi, Purushothaman, Sampath, Darnon, Maxime, Lofaro, Mike F., Cohen, Stephan A., Doyle, James P., Fuller, Nicholas, Magbitang, Teddie P., Rice, Philip M., Krupp, Leslie E., Nakagawa, Hisashi, Nobe, Youhei, Kokubo, Terukazu, Dubois, Geraud J. M.

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3D integration method using SOI substrates and structures produced thereby von Purushothaman, Sampath, Yu, Roy Rongqing

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3D integration method using SOI substrates and structures produced thereby von Purushothaman, Sampath, Yu, Roy Rongqing

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3D integration method using SOI substrates and structures produced thereby von Purushothaman, Sampath, Yu, Roy Rongqing

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Integration of Photo-Patternable Low-$\kappa$ Material into Advanced Cu Back-End-Of-The-Line von Lin, Qinghuang, Nelson, Alshakim, Chen, Shyng-Tsong, Brock, Philip, Cohen, Stephan A, Davis, Blake, Kaplan, Richard, Kwong, Ranee, Liniger, Eric, Neumayer, Debra, Patel, Jyotica, Shobha, Hosadurga, Sooriyakumaran, Ratnam, Purushothaman, Sampath, Miller, Robert, Spooner, Terry, Wisnieff, Robert

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Novel 3D Integration Method Using SOI Substrates and Structures Produced Thereby von Purushothaman, Sampath, Yu, Roy Ronguing

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NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRODUCED THEREBY von Purushothaman, Sampath, Yu, Roy Ronguing

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Hybrid lithography: The marriage between optical and e-beam lithography. A method to study process integration and device performance for advanced device nodes von Steen, Steven, McNab, Sharee J., Sekaric, Lidija, Babich, Inna, Patel, Jyotica, Bucchignano, Jim, Rooks, Michael, Fried, David M., Topol, Anna W., Brancaccio, Jim R., Yu, Roy, Hergenrother, John M., Doyle, James P., Nunes, Ron, Viswanathan, Raman G., Purushothaman, Sampath, Rothwell, Mary Beth

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Novel 3D Integration Method Using SOI Substrates And Structures Produced Thereby von Yu Roy R, Purushothaman Sampath

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Novel 3D Integration Method Using SOI Substrates and Structures Produced Thereby von PURUSHOTHAMAN Sampath, Yu Roy Ronguing

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NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRODUCED THEREBY von Purushothaman, Sampath, YU, Roy RONGUING

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Capping coating for 3D integration applications von TOPOL ANNA W, PURUSHOTHAMAN SAMPATH

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