Effect of Particle Size on Melting of Aluminum at Nano Scales von Puri, Puneesh, Yang, Vigor

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A general theory of ignition and combustion of nano- and micron-sized aluminum particles von Sundaram, Dilip Srinivas, Puri, Puneesh, Yang, Vigor

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Thermo-mechanical behavior of nano aluminum particles with oxide layers during melting von Puri, Puneesh, Yang, Vigor

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Thermochemical Behavior of Nickel-Coated Nanoaluminum Particles von Sundaram, Dilip S, Puri, Puneesh, Yang, Vigor

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Effect of voids and pressure on melting of nano-particulate and bulk aluminum von Puri, Puneesh, Yang, Vigor

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Pyrophoricity of nascent and passivated aluminum particles at nano-scales von Sundaram, Dilip Srinivas, Puri, Puneesh, Yang, Vigor

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Thermochemical behavior of nano-sized aluminum-coated nickel particles von Sundaram, Dilip Srinivas, Puri, Puneesh, Yang, Vigor

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Ignition characteristics of cracked JP-7 fuel von Puri, Puneesh, Ma, Fuhua, Choi, Jeong-Yeol, Yang, Vigor

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INSULATING LINER FOR A THROUGH-BODY VIA AND CORRESPONDING METHOD OF DEPOSITION von PURI, Puneesh, KANG, Jiho, JEONG, James Y

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THROUGH-BODY VIA LINER DEPOSITION von PURI, Puneesh, KANG, Jiho, JEONG, James Y

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Through-body via liner deposition von Puri Puneesh, Kang Jiho, Jeong James Y

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INSULATING LINER FOR A THROUGH-BODY VIA AND CORRESPONDING METHOD OF DEPOSITION von PURI, Puneesh, KANG, Jiho, JEONG, James Y

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THROUGH-BODY VIA LINER DEPOSITION von KANG JIHO, PURI PUNEESH, JEONG JAMES Y

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THROUGH-BODY VIA LINER DEPOSITION von PURI, PUNEESH, KANG, JIHO, JEONG, JAMES, Y

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Zwischenverbindungsstruktur umfassend Metall-Rückseiten-Umverteilungsleitungen mit sehr kleinem Teilungsabstand kombiniert mit Durchkontaktierungen von Lee, Kevin J, Puri, Puneesh, Kang, Jiho, Jeong, James Y, Telang, Adwait, Muirhead, John, Chang, Hsiao-Kang, Patel, Nitin M

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Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias von Patel Nitin M, Puri Puneesh, Kang Jiho, Chang Hsiao-Kang, Jeong James Y, Telang Adwait, Muirhead John, Lee Kevin J

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THROUGH-BODY VIA LINER DEPOSITION von KANG JIHO, PURI PUNEESH, JEONG JAMES Y

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Through-body via liner deposition von KANG JIHO, PURI PUNEESH, JEONG JAMES Y

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Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias von JIHO KANG, HSIAO-KANG CHANG, JOHN MUIRHEAD, JAMES Y JEONG, KEVIN J LEE, PUNEESH PURI, ADWAIT TELANG, NITIN M PATEL

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INTERCONNECT STRUCTURE COMPRISING FINE PITCH BACKSIDE METAL REDISTRIBUTION LINES COMBINED WITH VIAS von LEE KEVIN J, KANG JIHO, MUIRHEAD JOHN, PATEL NITIN M, JEONG JAMES Y, PURI PUNEESH, CHANG HSIAO-KANG, TELANG ADWAIT

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