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Printed circuit board from fibres impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether : Walles, E.W., Lupinski, J.H., Markovitz, M., Colborn, R.E., Presley, J.R., Davis, M.J., Minnick, M.G., Kubisen, S.J., Hallgren, J.E., Bolon, D.A., Eddy, V.J. and Irwin, P.C. (General Electric Company, Schenectady, NY, USA) US Pat 4975319 (4 December 1990)
Veröffentlicht in Composites
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Smart Bioimpedance Spectroscopy Device for Body Composition Estimation
Veröffentlicht in Sensors (Basel, Switzerland)
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The ITER disruption mitigation trigger: developing its preliminary design
Veröffentlicht in Nuclear fusion
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Overview of the preliminary design of the ITER plasma control system
Veröffentlicht in Nuclear fusion
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