Kula Belgrade - Part 2: Specifics of construction of Kula structure von Miljković, Nemanja, Milićević, Mladen, Ristić, Svetlana, Popović, Darko, Alendar, Vanja

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Kula Belgrade: Part 1: Specific topics of structural design von Miljković, Nemanja, Milićević, Mladen, Ristić, Svetlana, Popović, Darko, Alendar, Vanja

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INFORMATION SYSTEM FOR SCIENTIFIC STUDY OF THE MICROMETEOROLOGY OF KARST CAVES - CASE OF POSTOJNSKA JAMA CAVE, SLOVENIA von Mlakar, Primož, Grašič, Boštjan, Božnar, Marija Zlata, Popović, Darko, Gabrovšek, Franci

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Information system for scientific study of the micrometeorology of karst caves – Case of Postojnska jama cave, Slovenija von Mlakar, Primož, Grašič, Boštjan, Božnar, Marija Zlata, Popović, Darko, Gabrovšek, Franci

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Multibeam antennas with polarization and angle diversity von Popovic, D., Popovic, Z.

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X-ray diffraction study of microstructural evolution of some ZrO2–Y2O3–MgO powder mixtures induced by high-energy ball milling von Stubičar, Nada, Bermanec, Vladimir, Stubičar, Mirko, Popović, Darko, Kaysser, Wolfgang A.

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Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methods von Popovic, Darko, Lisk, Durodami, Li, Yue

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Virtual channel space-time processing with dual-polarization discrete lens antenna arrays: Antennas and propagation applications. Part I von YAN ZHOU, RONDINEAU, Sébastien, POPOVIC, Darko, SAYEED, Akbar, POPOVIC, Zoya

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Employing coherent detection for on-chip six-axis position sensors von Chow, Alex, Ho, Ron, Hopkins, David, Popovic, Darko

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MULTIPLE (MULTI-) DIE INTEGRATED CIRCUIT (IC) PACKAGES FOR SUPPORTING HIGHER CONNECTION DENSITY, AND RELATED FABRICATION METHODS von Popovic, Darko, Lisk, Durodami, Li, Yue

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Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package : Advances in wafer level packaging von SZE, Theresa, POPOVIC, Darko, JING SHI, LAI, Yi-Shao, MITCHELL, James G, GUENIN, Bruce, TSAI, Tsung-Yueh, KAO, Chin-Li, GIERE, Matthew

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MULTI-DIE INTEGRATED CIRCUIT PACKAGES FOR SUPPORTING HIGHER CONNECTION DENSITY, AND RELATED FABRICATION METHODS von LI, Yue, POPOVIC, Darko, LISK, Durodami

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Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package von Sze, Theresa, Popovic, Darko, Shi, Jing, Lai, Yi-Shao, Mitchell, James G., Guenin, Bruce, Tsai, Tsung-Yueh, Kao, Chin-Li, Giere, Matthew

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Crosstalk reduction in electrical interconnects von Popovic, Darko R

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A lens antenna array with adaptive optical processing von Fotheringham, E., Romisch, S., Smith, P.C., Popovic, D., Anderson, D.Z., Popovic, Z.

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MULTI-DIE INTEGRATED CIRCUIT PACKAGES FOR SUPPORTING HIGHER CONNECTION DENSITY, AND RELATED FABRICATION METHODS von LI, Yue, POPOVIC, Darko, LISK, Durodami

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STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DEVICE von LI, Yue, POPOVIC, Darko, MIRANDA CORBALAN, Miguel, LISK, Durodami, KHAN, Irfan

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STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DEVICE von LI, Yue, POPOVIC, Darko, MIRANDA CORBALAN, Miguel, LISK, Durodami, KHAN, Irfan

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CROSSTALK REDUCTION IN ELECTRICAL INTERCONNECTS von POPOVIC DARKO R

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Crosstalk reduction in electrical interconnects von Popovic Darko R

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