Frequency-Domain Electrothermal Impedance Spectroscopy of an Actively Switching Power Semiconductor Converter von Polom, Timothy A., Andresen, Markus, Liserre, Marco, Lorenz, Robert D.

Volltext

Degradation Diagnosis of Power Modules Based on Thermal Phase Response Sensing and Artificial Neural Networks von van der Broeck, Christoph H., Polom, Timothy A., De Doncker, Rik W.

Volltext

Real-Time Monitoring of Thermal Response and Life-Time Varying Parameters in Power Modules von van der Broeck, Christoph H., Polom, Timothy A., Lorenz, Robert D., De Doncker, Rik W.

Volltext

Evaluating On-State Voltage and Junction Temperature Monitoring Concepts for Wide-Bandgap Semiconductor Devices von Fritz, Niklas, Kamp, Tobias, Polom, Timothy A., Friedel, Maximilian, Doncker, Rik W. De

Volltext

Power Device Interface Characterization With Low-Cost Thermal System Identification von Polom, Timothy A., Lorenz, Robert D.

Volltext

Reviewing Thermal-Monitoring Techniques for Smart Power Modules von Kalker, Sven, Ruppert, Lukas A., van der Broeck, Christoph H., Kuprat, Johannes, Andresen, Markus, Polom, Timothy A., Liserre, Marco, De Doncker, Rik W.

Volltext

Designing Power Module Health Monitoring Systems Based on Converter Load Profile von Polom, Timothy A., van der Broeck, Christoph H., De Doncker, Rik W., Lorenz, Robert D.

Volltext

Exploiting Distinct Thermal Response Properties for Power Semiconductor Module Health Monitoring von Polom, Timothy A., van der Broeck, Christoph H., De Doncker, Rik W., Lorenz, Robert D.

Volltext

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging von Roshanghias, Ali, Malago, Perla, Kaczynski, Jaroslaw, Polom, Timothy, Bardong, Jochen, Holzmann, Dominik, Malik, Muhammad-Hassan, Ortner, Michael, Hirschl, Christina, Binder, Alfred

Volltext

Control of Junction Temperature and Its Rate of Change at Thermal Boundaries via Precise Loss Manipulation von Polom, Timothy Allen, Wang, Boru, Lorenz, Robert D.

Volltext

Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters von Hasan, Md. Nazmul, Polom, Timothy, Holzmann, Dominik, Malagó, Perla, Binder, Alfred, Roshanghias, Ali

Volltext