Tin pest issues in lead-free electronic solders: Lead-free electronic solders von PLUMBRIDGE, W. J

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Recent Observations on Tin Pest Formation in Solder Alloys von Plumbridge, W.J.

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Further Observations on Tin Pest Formation in Solder Alloys von Plumbridge, W.J.

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Fatigue resistance and structure (30 years on) von PLUMBRIDGE, W. J.

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The creep of lead-free solders at elevated temperatures von PLUMBRIDGE, W. J, GAGG, C. R, PETERS, S

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Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach von RIST, Martin A, PLUMBRIDGE, W. J, COOPER, S

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Solders in electronics von PLUMBRIDGE, W. J

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Tin pest in lead-containing solders von Plumbridge, W.J

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Damage produced in solder alloys during thermal cycling von LIU, X. W, PLUMBRIDGE, W. J

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Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints von LIU, X. W, PLUMBRIDGE, W. J

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Long term mechanical reliability with lead-free solders von Plumbridge, W.J

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Crack Healing in a Silicon Nitride Ceramic von Zhang, Yan Hui, Edwards, Lyndon, Plumbridge, William J.

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Structural integrity in electronics von PLUMBRIDGE, W. J., KARIYA, Y.

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The analysis of creep data for solder alloys von Plumbridge, W.J

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Implementing lead-free solders - the performance aspects von Plumbridge, W.J

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New avenues for failure analysis von Plumbridge, W.J.

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Defects in electronics and their significance for structural integrity von PLUMBRIDGE, W. J.

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Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling von LIU, X. W, PLUMBRIDGE, Wj

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High-strain fatigue of Pb-Sn eutectic solder alloy von JIANG, H, HERMANN, R, PLUMBRIDGE, W. J

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Tin pest in electronics? von Plumbridge, W.J.

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