Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean? von Gharaibeh, Mohammad A., Pitarresi, James M.

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Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method von Gharaibeh, Mohammad A., Pitarresi, James M.

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Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys von Gharaibeh, Mohammad, Stewart, Aaron J, Su, Quang T, Pitarresi, James M

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A Pair of Partially Coupled Beams Subjected to Concentrated Force von Gharaibeh, Mohammad A., Dapeng Liu, Pitarresi, James M.

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Analytical Solution for Electronic Assemblies Under Vibration von Gharaibeh, Mohammad A, Su, Quang T, Pitarresi, James M

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Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking von Su, Quang T, Gharaibeh, Mohammad A, Stewart, Aaron J, Pitarresi, James M, Anselm, Martin K

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Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures Under Mechanical Shock von Younis, M.I., Jordy, D., Pitarresi, J.M.

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A methodology to calculate the equivalent static loading for simulating electronic assemblies under impact von Gharaibeh, Mohammad A., Pitarresi, James M.

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An efficient equivalent static methodology for simulating electronic packages subjected to resonant vibrations von Gharaibeh, Mohammad A., Pitarresi, James M.

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“I know what I need to learn”: The intersection of aspirational and navigational capitals for marginalized‐identity STEM students von Sausner, Erica B., Wentzel, Cassandra, Pitarresi, James

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Analytical model for the transient analysis of electronic assemblies subjected to impact loading von Gharaibeh, Mohammad A., Su, Quang T., Pitarresi, James M.

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Analysis of Intramedullary Beam Designs Using Customized Finite Element Models for Medial Column Arthrodesis of the Foot von Simonik, Melissa M., Pitarresi, James, Willing, Ryan

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Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation von Park, S. B, Shah, Chirag, Kwak, Jae B, Jang, Changsoo, Chung, Soonwan, Pitarresi, James M

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Effect of geometry and temperature cycle on the reliability of WLCSP solder joints von Chaparala, S.C., Roggeman, B.D., Pitarresi, J.M., Sammakia, B.G., Jackson, J., Griffin, G., McHugh, T.

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Structural Control by Temporal Finite Elements von Pitarresi, James M, Manolis, George D

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Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact von Seungbae Park, Chirag Shah, Jae Kwak, Changsoo Jang, Pitarresi, J., Taesang Park, Seyoung Jang

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Effect of temperature on transition in failure modes for high speed impact test of solder joint and comparison with board level drop test von Guruprasad, Pradosh, Pitarresi, James, Sykes, Bob

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Comparison of joint level impact fatigue resistance and board level drop test von Guruprasad, P., Pitarresi, J.

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Board level energy correlation and interconnect reliability modeling under drop impact von Agrawal, A., Levo, T., Pitarresi, J., Roggeman, B.

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Impact of board configuration and shock loading conditions for board level drop test von Guruprasad, P., Roggeman, B., Pitarresi, J.

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