Development of customized finite element models of medial column fixation using an intramedullary beam: A computational sensitivity analysis von Simonik, Melissa M., Pitarresi, J.M., Willing, R.

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Effect of voids on the reliability of BGA/CSP solder joints von Yunus, Mohammad, Srihari, K., Pitarresi, J.M., Primavera, Anthony

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Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies von Chaparala, S, Pitarresi, J. M, Parupalli, S, Mandepudi, S, Meilunas, M

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Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures Under Mechanical Shock von Younis, M.I., Jordy, D., Pitarresi, J.M.

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Effect of geometry and temperature cycle on the reliability of WLCSP solder joints von Chaparala, S.C., Roggeman, B.D., Pitarresi, J.M., Sammakia, B.G., Jackson, J., Griffin, G., McHugh, T.

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The temporal finite element method in structural dynamics von Pitarresi, J.M., Manolis, G.D.

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A lamination study of a composite LCD flat panel display von Greenfield, P., Pitarresi, J., Lehmann, G., Skinner, D., Lee, J., Sammakia, B., Zou, J.

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Optimal Design Procedures for Active Structures von Cha, J. Z, Pitarresi, J. M, Soong, T. T

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Dynamic modeling and measurement of personal computer motherboards von Pitarresi, J., Geng, P., Beltman, W., Yun Ling

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A parametric solder joint reliability model for wafer level-chip scale package von Pitarresi, J., Chaparala, S., Sammakia, B., Nguyen, L., Patwardhan, V., Zhang, L., Kelkar, N.

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Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact von Seungbae Park, Chirag Shah, Jae Kwak, Changsoo Jang, Pitarresi, J., Taesang Park, Seyoung Jang

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Board level energy correlation and interconnect reliability modeling under drop impact von Agrawal, A., Levo, T., Pitarresi, J., Roggeman, B.

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Comparison of joint level impact fatigue resistance and board level drop test von Guruprasad, P., Pitarresi, J.

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Impact of board configuration and shock loading conditions for board level drop test von Guruprasad, P., Roggeman, B., Pitarresi, J.

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Assessment of PCB pad cratering resistance by joint level testing von Roggeman, B., Borgesen, P., Jing Li, Godbole, G., Tumne, P., Srihari, K., Levo, T., Pitarresi, J.

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Response of an electrostatically actuated microbeam to drop-table test von Ouakad, H., Younis, M. I., Alsaleem, F., Levo, T., Pitarresi, J.

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Reliability assessment of electronic components under random vibration loading von Al-Yafawi, A., Da Yu, Seungbae Park, Pitarresi, J., Soonwan Chung

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Post Buckling Analysis of Thin Membrane for the Flexible Electronics von Seungbae Park, Jia Gao, Agrawal, D., Pitarresi, J., Homentcovsch, D.

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Stress Analysis of Component Attachments to Printed Circuit Boards von Prakash, V, Engel, P.A, Pitarresi, J.M, Albert, T, Westby, G

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Nonlinear analysis using temporal finite elements von Gellin, Slade, Pitarresi, James M.

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