Prediction of Gas Solubility in Ionic Liquids Using the Cosmo-Sac Model von Jaschik, Manfred, Piech, Daniel, Warmuzinski, Krzysztof, Jaschik, Jolanta

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Intense and quick land relief transformation in the Little Ice Age: The age of accumulative fan deposits in Serteyka River Valley (Western East European Plain) von Ginter, Artur, Piech, Wiktor, Krąpiec, Marek, Moska, Piotr, Sikorski, Jarosław, Hrynowiecka, Anna, Stachowicz-Rybka, Renata, Cywa, Katarzyna, Piotrowska, Natalia, Mroczkowska, Agnieszka, Tołoczko, Wojciech, Okupny, Daniel, Mazurkevich, Andrey, Kittel, Piotr

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Fault diagnosis of electrical faults of three phase induction motors using acoustic analysis von Lucas, Guilherme Beraldi, Lui, Hui, Brumercik, Frantisek, Glowacz, Adam, Sulowicz, Maciej, Kozik, Jarosław, Irfan, Muhammad, Piech, Krzysztof, Gutten, Miroslav, Korenciak, Daniel, Glowacz, Witold, Caesarendra, Wahyu, Li, Zhixiong, Kumar, Anil

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Fault diagnosis of electrical faults of three-phasei nduction motors using acoustic analysis von Adam Glowacz, Maciej Sulowicz, Jarosław Kozik, Krzysztof Piech, Witold Glowacz, Zhixiong Li, Frantisek Brumercik, Miroslav Gutten, Daniel Korenciak, Anil Kumar, Guilherme Beraldi Lucas, Muhammad Irfan, Wahyu Caesarendra, Hui Lui

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Sentiment analysis, topic modelling and social network analysis: COVID-19, protest movements and the Polish Tweetosphere von Jarynowski, Andrzej, Płatek, Daniel

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Inorganic wafer having through-holes attached to semiconductor wafer von Piech, Garrett Andrew, Levesque, Jr., Daniel Wayne, Shorey, Aric Bruce

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Laser cutting and processing of display glass compositions von Piech, Garrett Andrew, Wagner, Robert Stephen, Pastel, David Andrew, N'Gom, Moussa, Watkins, James Joseph, Schnitzler, Daniel, Marjanovic, Sasha, Hackert, Thomas, Li, Xinghua

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SILICA-CONTAINING SUBSTRATES WITH VIAS HAVING AN AXIALLY VARIABLE SIDEWALL TAPER AND METHODS FOR FORMING THE SAME von HUANG, Tian, JIN, Yuhui, DAHLBERG, Rachel Eileen, PIECH, Garrett Andrew, RICKETTS, Daniel Ohen

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Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same von Dahlberg, Rachel Eileen, Piech, Garrett Andrew, Jin, Yuhui, Huang, Tian, Ricketts, Daniel Ohen

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Inorganic wafer having through-holes attached to semiconductor wafer von Piech, Garrett Andrew, Levesque, Jr., Daniel Wayne, Shorey, Aric Bruce

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Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching von Gaab, Andreas Simon, Piech, Garrett Andrew, Sternquist, Daniel Arthur, Webb, Michael Brian, Ruffin, Alranzo Boh, Boek, Heather Debra

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LASER CUTTING AND PROCESSING OF DISPLAY GLASS COMPOSITIONS von SCHNITZLER, Daniel, WATKINS, James Joseph, HACKERT, Thomas, N'GOM, Moussa, MARJANOVIC, Sasha, PASTEL, David Andrew, WAGNER, Robert Stephen, PIECH, Garrett Andrew, LI, Xinghua

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SYSTEMS AND METHODS FOR REDUCING SUBSTRATE SURFACE DISRUPTION DURING VIA FORMATION von GARNER, Sean, VANSELOUS, Heather, MANLEY, Robert, LEVESQUE, Daniel, PIECH, Garrett, VADDI, Rajesh

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LASER CUTTING AND PROCESSING OF DISPLAY GLASS COMPOSITIONS von SCHNITZLER, Daniel, WATKINS, James Joseph, HACKERT, Thomas, N'GOM, Moussa, MARJANOVIC, Sasha, PASTEL, David Andrew, WAGNER, Robert Stephen, PIECH, Garrett Andrew, LI, Xinghua

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ENCLOSED SPACE AIR CONDITIONING SYSTEMS von ARCHIBALD, Daniel P, SZELAG, Wojciech, JEDRYCZKA, Cezary, PIECH, Zbigniew, WITCZAK, Tadeusz Pawel

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SILICA-CONTAINING SUBSTRATES WITH VIAS HAVING AN AXIALLY VARIABLE SIDEWALL TAPER AND METHODS FOR FORMING THE SAME von HUANG, Tian, JIN, Yuhui, DAHLBERG, Rachel Eileen, PIECH, Garrett Andrew, RICKETTS, Daniel Ohen

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SILICA-CONTAINING SUBSTRATES WITH VIAS HAVING AN AXIALLY VARIABLE SIDEWALL TAPER AND METHODS FOR FORMING THE SAME von Dahlberg, Rachel Eileen, Piech, Garrett Andrew, Jin, Yuhui, Huang, Tian, Ricketts, Daniel Ohen

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SILICA-CONTAINING SUBSTRATES WITH VIAS HAVING AN AXIALLY VARIABLE SIDEWALL TAPER AND METHODS FOR FORMING THE SAME von HUANG, Tian, JIN, Yuhui, DAHLBERG, Rachel Eileen, PIECH, Garrett Andrew, RICKETTS, Daniel Ohen

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SYSTEMS AND METHODS FOR REDUCING SUBSTRATE SURFACE DISRUPTION DURING VIA FORMATION von Piech, Garrett Andrew, Levesque, JR., Daniel Wayne, Vaddi, Rajesh, Manley, Robert George, Vanselous, Heather Nicole, Garner, Sean Matthew

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METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS von BURKET, Robert Carl, VANSELOUS, Heather Nicole, WIELAND, Kristopher Allen, LEVESQUE, Daniel Wayne, MARJANOVIC, Sasha, PIECH, Garrett Andrew

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