Spray coating of photoresist for pattern transfer on high topography surfaces von Pham, Nga P, Burghartz, Joachim N, Sarro, Pasqualina M

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Highly Selective Color Filters Based on Hybrid Plasmonic–Dielectric Nanostructures von De Proft, Anabel, Lodewijks, Kristof, Figeys, Bruno, Kouznetsov, Dmitry, Verellen, Niels, Pham, Nga P, Vereecke, Bart, Sabuncuoglu Tezcan, Deniz, Jansen, Roelof, Van Dorpe, Pol, Rottenberg, Xavier

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Effects of work environment on transfer of training: empirical evidence from Master of Business Administration programs in Vietnam von Pham, Nga T. P., Segers, Mien S. R., Gijselaers, Wim H.

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Metal patterning on high topography surface for 3D RF devices fabrication von Pham, Nga P., Boellaard, E., Wien, W., van den Brekel, L.D.M., Burghartz, J.N., Sarro, P.M.

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Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects von Cherman, Vladimir O., Pham, Nga P., Slabbekoorn, John, Faes, Alessandro, Margesin, Benno, Tilmans, Harrie A.C.

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Use of Polymer Liners for 3D-WLP TSVs: Process, Reliability and Cost von Sabuncuoglu Tezcan, Deniz, Pham, Nga P., Majeed, Bivragh, Civale, Yann, Beyne, Eric

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Effects of work environment on transfer of training: empirical evidence from M aster of B usiness A dministration programs in V ietnam von Pham, Nga T. P., Segers, Mien S. R., Gijselaers, Wim H.

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Wafer bow of substrate transfer process for GaNLED on Si 8 inch von Pham, N. P., Rosmeulen, M., Bryce, G., Tezcan, D. S., Majeed, B., Osman, H.

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Process challenges in 0-level packaging using 100μm-thin chip capping with TSV von Pham, Nga P., Cherman, Vladimir, Tutunjyan, Nina, Teugels, Lieve, Tezcan, Deniz S., Tilmans, Harrie A.C.

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Parylene N as a dielectric material for through silicon vias von Majeed, B., Pham, N.P., Tezcan, D.S., Beyne, E.

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Substrate Transfer for GaN based LEDs grown on Silicon von Pham, Nga P., Rosmeulen, Maarten, Demeulemeester, Cindy, Motsnyi, Vasyl, Tezcan, Deniz S., Osman, Haris

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Metal-bonded, hermetic 0-level package for MEMS von Pham, N P, Limaye, P, Czarnecki, P, Olalla, V P, Cherman, V, Tezcan, D S, Tilmans, H A C

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Use of Polymer Liners for 3D-WLP TSVs: Process, Reliability and Cost von Sabuncuoglu Tezcan, Deniz, Pham, Nga P., Majeed, Bivragh, Civale, Yann, Beyne, Eric

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Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding von Pham, N. P., Cherman, V., Vandevelde, B., Limaye, P., Tutunjyan, N., Jansen, R., Van Hoovels, N., Tezcan, D. S., Soussan, P., Beyne, E., Tilmans, H. A. C.

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Spray coating of photoresist for realizing through-wafer interconnects von Pham, N.P., Bulcke, M.V., De Moor, P.

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Lithography for Patterning inside through-Si Vias von Pham, N.P., Tezcan, D.S., Majeed, B., De Moor, P., Baert, K., Swinnen, B., Ruythooren, W.

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Complete genome sequence of a novel lytic phage of Xanthomonas oryzae pv. oryzae, the bacterial leaf blight pathogen in rice von My, Pham D.T., Vinh, Tu Q., Ngoc, To H., Anh, Pham N.Q., Duyen, Le T. M., Thien, Nguyen M., Tien, Le T.T., Phuc, Vo T., Oanh, Huynh N., Nga, Le P., Hoang, Hoang A.

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Association between Hypertension and Stroke Recurrence as Modified by Pro-oxidant-Antioxidant Balance: A Multi-Center Study von Pham, Thu T M, Duong, Tuyen Van, Nguyen, Lien T K, Vu, Manh-Tan, Pham, Khue M, Nguyen, Minh H, Luong, Thuc C, Do, Binh N, Le, Lan T H, Dang, Nga H, Nguyen, Thao T P, Le, Hoang P, Tran, Cuong Q, Nguyen, Kien T, Hu, Chaur-Jong, Chan, Chang-Chuan, Hsu, Hui-Chuan, Bai, Chyi-Huey

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Antibiotic use and resistance in emerging economies: a situation analysis for Viet Nam von Nguyen, Kinh Van, Thi Do, Nga Thuy, Chandna, Arjun, Nguyen, Trung Vu, Pham, Ca Van, Doan, Phuong Mai, Nguyen, An Quoc, Thi Nguyen, Chuc Kim, Larsson, Mattias, Escalante, Socorro, Olowokure, Babatunde, Laxminarayan, Ramanan, Gelband, Hellen, Horby, Peter, Thi Ngo, Ha Bich, Hoang, Mai Thanh, Farrar, Jeremy, Hien, Tran Tinh, Wertheim, Heiman F L

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A Trial of Itraconazole or Amphotericin B for HIV-Associated Talaromycosis von Le, Thuy, Kinh, Nguyen Van, Cuc, Ngo T.K, Tung, Nguyen L.N, Lam, Nguyen T, Thuy, Pham T.T, Cuong, Do D, Phuc, Pham T.H, Vinh, Vu H, Hanh, Doan T.H, Tam, Vu Van, Thanh, Nguyen T, Thuy, Tran P, Hang, Nguyen T, Long, Hoang B, Nhan, Ho T, Wertheim, Heiman F.L, Merson, Laura, Shikuma, Cecilia, Day, Jeremy N, Chau, Nguyen V.V, Farrar, Jeremy, Thwaites, Guy, Wolbers, Marcel

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