Ormes (Marne). Les Perches – Site 10 du contournement sud de Reims von Peyne, Nicolas, Bidault, Estelle

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Novel dielectric capping layer approach for advanced copper interconnects using chemical grafting von Bispo, I., Couturier, B., Haumesser, P.H., Mangiagalli, P., Monchoix, H., Passemard, G., Peyne, C., Roy, S., Thieriet, N., Rabinzohn, P., Bureau, C.

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Châlette-sur-Loing (Loiret). La Petite-Pontonnerie von Peyne, Nicolas, Creissen, Thomas

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Cleaning status on low- k dielectric in advanced VLSI interconnect: : Characterisation and principal issues von Louis, D, Beverina, A, Arvet, C, Lajoinie, E, Peyne, C, Holmes, D, Maloney, D

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Improved post etch cleaning for low-k and copper integration for 0.18μm technology von Louis, D., Peyne, C., Lajoinie, E., Vallesi, B., Holmes, D., Maloney, D., Lee, S.

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Resist removal process in dual damascene structure integrating Cu and SiLK ® for 0.18 μm technology von Louis, D., Arvet, C., Lajoinie, E., Peyne, C., Lee, S., Berry, I., Han, Q.

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Post SiN Etching Cleaning During Copper and Low K Integration von Holmes, Douglas, Maloney, D., Arvet, C., Lajoinie, E., Lee, W.M., Beverina, Alessio, Louis, Didier, Besson, Pascal, Peyne, C., Lee, S.

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Cleaning status on low-k dielectric in advanced VLSI interconnect von Louis, D, Beverina, A, Arvet, C, Lajoinie, E, Peyne, C, Holmes, D, Maloney, D

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Post etch cleaning of dual damascene system integrating copper and SiLK von LOUIS, D, PEYNE, C, ARVET, C, LAJOINIE, E, MALONEY, D, LEE, S

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Cleaning process strategies compatible with low-k dielectric and copper: state of the art, evolution and perspectives von Louis, D., Beverina, A., Arvet, C., Lajoinie, E., Peyne, C., Holmes, D., Maloney, D., Lee, S., Lee, W.M.

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Cleaning status on low-κ dielectric in advanced VLSI interconnect : Characterisation and principal issues von LOUIS, D, BEVERINA, A, ARVET, C, LAJOINIE, E, PEYNE, C, HOLMES, D, MALONEY, D

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Post etch cleaning of dual damascene system integrating copper and SiLK/sup TM von Louis, D., Peyne, C., Arvet, C., Lajoinie, E., Maloney, D., Lee, S.

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An electrical test structure to evaluate substrate compatibility with wafer cleaning von Peyne, C.M., Fallon, M., Stevenson, J.T.M., Walton, A.J.

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Test structures for characterising a damascene CMP interconnect process von Peyne, C.M., O'Hara, A., Stevenson, J.T.M., Elliott, J.P., Walton, A.J., Fallon, M.

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Etude de l'amélioration et de la revalorisation des matières premières argileuses utilisées dans les briques en terre cuite : de l'amélioration du procédé à la revalorisation des d... von Peyne, Julie

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Communes d’Ahun, Chamberaud, Cressat, Fransèches, Lavaveix-les-Mines, Mazeirat, Moutier-d’Ahun, Pionnat, Saint-Hilaire-la-Plaine, Saint-Martial-le-Mont, Saint-Pardoux-les-Cards, Vi... von Peyne, Matthieu

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Blois – Rue de la Motte von Peyne, Nicolas

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Une occupation Hallstatt final-La Tène ancienne : le Haut des Vignes à Dadonville (Loiret) von Bakkal-Lagarde, Marie-Claude, Peyne, Nicolas

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Naves – La Geneste von Peyne, Nicolas

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Mézières-sur-Issoire – Chambrotaud von Peyne, Nicolas

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