Development and qualification of copper wire bond process for automotive applications von Pey Fang Hiew, Yin Kheng Au, Poh Leng Eu

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Systematic Pd Cu wire bond recipe development flow for successful qualification result von Law Lai Cheng, Wong Boh Kid, Hiew Pey Fang, Eu Poh Leng

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SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD THEREFOR von Huang, Wen Hung, Yang, Shu-Han, Mao, Kuan-Hsiang, Hiew, Pey Fang

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SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD THEREFOR von Huang, Wen Hung, Yang, Shu-Han, Mao, Kuan-Hsiang, Hiew, Pey Fang

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SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THEREFOR von Huang, Wen Hung, Mao, Kuan-Hsiang, Hiew, Pey Fang, Tay, Sharon Huey Lin, Chuang, Wen Yuan, Siong, Chin Teck

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SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THEREFOR von Huang, Wen Hung, Mao, Kuan-Hsiang, Hiew, Pey Fang, Tay, Sharon Huey Lin, Chuang, Wen Yuan, Siong, Chin Teck

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Semiconductor package with inner and outer leads von HIEW PEY FANG, YAP JIA LIN, AU YIN KHENG

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SEMICONDUCTOR PACKAGE WITH INNER AND OUTER LEADS von HIEW PEY FANG, YAP JIA LIN, AU YIN KHENG

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SEMICONDUCTOR PACKAGE WITH INTERIOR LEADS von HIEW PEY FANG, TEH SEOH HIAN, YAP JIA LIN, KHOO LY HOON, AU YIN KHENG

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