Room temperature negative differential resistance in DNA-based molecular devices von Jangjian, Peng-Chung, Liu, Tzeng-Feng, Li, Mei-Yi, Tsai, Ming-Shih, Chang, Chia-Ching

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DNA Mismatch Detection by Metal Ion Enhanced Impedance Analysis von Peng-Chung Jangjian, Tzeng-Feng Liu, Chuan-Mei Tsai, Mei-Yi Li, Ming-Shih Tsai, Shin-Hua Tseng, Tsai-Mu Cheng, Chia-Ching Chang

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Ni2+-enhanced charge transport via π-π stacking corridor in metallic DNA von Tseng, Shin-Hua, JangJian, Peng-Chung, Tsai, Chuan-Mei, Cheng, Tsai-Mu, Chu, Hsueh-Liang, Chang, Yu-Chuan, Chung, Wei-Hsien, Chang, Chia-Ching

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Ni2+ Enhanced Charge Transport via Pi Pi Stacking Corridor in Metallic DNA von Chang, Chia-Ching, Tseng, Shin-Hua, JangJian, Peng-Chung, Tsai, Chuan-Mei, Cheng, Tsai-Mu, Chu, Hsueh-Liang

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Ni 2+ Enhanced Charge Transport via Pi Pi Stacking Corridor in Metallic DNA von Chang, Chia-Ching, Tseng, Shin-Hua, JangJian, Peng-Chung, Tsai, Chuan-Mei, Cheng, Tsai-Mu, Chu, Hsueh-Liang

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Ni[super]2+-Enhanced Charge Transport via [pi]-[pi] Stacking Corridor in Metallic DNA von Tseng, Shin-Hua, JangJian, Peng-Chung, Tsai, Chuan-Mei, Cheng, Tsai-Mu, Chu, Hsueh-Liang, Chang, Yu-Chuan, Chung, Wei-Hsien, Chang, Chia-Ching

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Ni^sup 2+^-Enhanced Charge Transport via [pi]-[pi] Stacking Corridor in Metallic DNA von Tseng, Shin-Hua, JangJian, Peng-Chung, Tsai, Chuan-Mei, Cheng, Tsai-Mu, Chu, Hsueh-Liang, Chang, Yu-Chuan, Chung, Wei-Hsien, Chang, Chia-Ching

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Ni 2+-Enhanced Charge Transport via π- π Stacking Corridor in Metallic DNA von Tseng, Shin-Hua, JangJian, Peng-Chung, Tsai, Chuan-Mei, Cheng, Tsai-Mu, Chu, Hsueh-Liang, Chang, Yu-Chuan, Chung, Wei-Hsien, Chang, Chia-Ching

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Polish Apparatus and Methods for Use von Yen, Chia-Hsiang, Jangjian, Peng-Chung

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SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION von LIAO, Kao-Feng, LIN, Yi-Cheng, JANGJIAN, Peng-Chung

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FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME von WU, Chen-Hao, HSIAO, Chun-Wen, LEE, Chu-An, CHAO, Huang-Lin, TSAI, Teng-Chun, JANGJIAN, Peng-Chung

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Fin isolation structure for FinFET and method of forming the same von Hsiao, Chun-Wen, Lee, Chu-An, Chao, Huang-Lin, Jangjian, Peng-Chung, Wu, Chen-Hao, Tsai, Teng-Chun

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FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME von WU, Chen-Hao, HSIAO, Chun-Wen, LEE, Chu-An, CHAO, Huang-Lin, TSAI, Teng-Chun, JANGJIAN, Peng-Chung

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Fin isolation structure for FinFET and method of forming the same von Hsiao, Chun-Wen, Lee, Chu-An, Chao, Huang-Lin, Jangjian, Peng-Chung, Wu, Chen-Hao, Tsai, Teng-Chun

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SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF von SHEN, Hsiang-Ku, LAI, Ying-Yao, CHEN, Dian-Hau, Chih, Fang-I, HUANG, Chen-Chiu, CHEN, ShuFang, LAN, Jo-Lin, CHANG, Wen-Ling, JANGJIAN, Peng-Chung, LIN, Chi-Feng

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FinFET contacts and method forming same von Liao, Kao-Feng, Hsiao, Chun-Wen, Chuang, Sheng-Chao, Ho, Hsin-Ying, Jangjian, Peng-Chung

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FINFET CONTACTS AND METHOD FORMING SAME von Liao, Kao-Feng, Hsiao, Chun-Wen, Chuang, Sheng-Chao, Ho, Hsin-Ying, Jangjian, Peng-Chung

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Chemical Mechanical Planarization Tool von Huang, Fu-Ming, Chen, Liang-Guang, Hsiao, Chun-Wen, Chuang, Sheng-Chao, Lin, Chun-Chieh, Jangjian, Peng-Chung, Cui, Ji James, Liao, Kao-Feng, Ho, Hsin-Ying, Chen, Chih Hung, Chen, Kei-Wei, Chang, Ting-Hsun, Yen, Michael

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FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME von WU, Chen-Hao, HSIAO, Chun-Wen, LEE, Chu-An, CHAO, Huang-Lin, TSAI, Teng-Chun, JANGJIAN, Peng-Chung

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Chemical mechanical planarization tool von Huang, Fu-Ming, Chen, Liang-Guang, Hsiao, Chun-Wen, Chuang, Sheng-Chao, Lin, Chun-Chieh, Jangjian, Peng-Chung, Cui, Ji James, Liao, Kao-Feng, Ho, Hsin-Ying, Chen, Chih Hung, Chen, Kei-Wei, Chang, Ting-Hsun, Yen, Michael

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