Interconnection and packaging of solid-state circuits von Pedder, D.J.

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Techniques for the Examination of Thick Film Resistor Microstructures by T.E.M von Pedder, D. J.

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Silver‐Ruthenium Dioxide Contacts von Pedder, D. J.

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Molecular weight index of the Merck Index for mass spectrometry von Sun, Tung, Pedder, D. J, Fales, H. M

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An apparatus used to determine the resistance to welding of electrical contact materials von Gill, J A, Pedder, D J, Douglas, P

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The Limitations of High Speed, High Density PWB Substrates von Curtis, J.C., Lodge, K.J., Pedder, D.J.

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Microwave characterization of microstrip lines and spiral inductors in MCM-D technology von Arnold, R.G., Pedder, D.J.

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MCM-D and direct module attach for RF applications von Arnold, R.G., Faulkner, C.C., Pedder, D.J.

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A pyroelectric vidicon with reticulated target von Pool, P. J., Pedder, D. J.

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Multichip Module Technology: The Transition from Research to Manufacture von Pedder, D.J

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The preparation and performance of reticulated targets for the pyroelectric vidicon von Warner, D. J., Pedder, D. J., Moody, I. S., Burrage, J.

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Flip Chip Solder Bonding for Microelectronic Applications von Pedder, D.J

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Silicon substrate test structures for hybrid wafer scale technology von Davies, M.J., Munns, A.G., Pedder, D.J.

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PROCEDE POUR LA FABRICATION D'UN MATERIAU COMPOSITE CONDUCTEUR ELECTRIQUE ET MATERIAU COMPOSITE AINSI OBTENU von D. J. PEDDER

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PROCEDE DE FABRICATION D'UN MATERIAU COMPOSITE CONDUCTEUR DE L'ELECTRICITE, ET MATERIAU COMPOSITE AINSI OBTENU von D. J. PEDDER

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Interlayer Alignment in Multilayer PCBs von Lodge, K.J., Pedder, D.J.

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IOAP-A Novel Process for the Manufacture of Long-Life Silver-Cadmium Oxide AC Contact Material von Pedder, D., Douglas, P., McCarthy, J., Brugner, F.

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Constituents of the venom of a south african fire ant ( solenopsis punctaticeps) : 2,5-dialkylpyrrolidines and -pyrrolines, identification and synthesis von Pedder, D.J., Fales, H.M., Jaouni, T., Blum, M., MacConnell, J., Crewe, Robin M.

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Surface Mounted IC Packages-Their Attachment and Reliability on PWBs von Brierley, C.J., Pedder, D.J.

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Techniques for the Inspection of Flip Chip Solder Bonded Devices von Burdett, P.A, Lodge, K.J, Pedder, D.J

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