Creep in chipboard [timber products]. 2. The use of fitted response curves for comparative and predictive purposes von Pierce, C.B, Dinwoodie, J.M, Paxton, B.H

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Modelling the creep behavior of chipboard: the rheological approach von Mundy, J.S, Bonfield, P.W, Dinwoodie, J.M, Paxton, B.H

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Fatigue and creep in chipboard: Part 2. The influence of slow cyclic fatigue on the creep behaviour of chipboard at a range of stress levels and moisture contents von Dinwoodie, J.M., Paxton, B.H., Bonfield, P.W., Mundy, J.S.

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Fatigue and creep in chipboard. 2. The influence of slow cyclic fatigue on the creep behaviour of chipboard at a range of stress levels and moisture contents von Dinwoodie, J.M, Paxton, B.H, Bonfield, P.W, Mundy, J.S

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Creep in chipboard: Part 8: The effect of steady-state moisture content, temperature and level of stressing on the relative creep behaviour and creep modulus of a range of boards von Dinwoodie, J.M., Robson, D.J., Paxton, B.H., Higgins, J.S.

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Creep in chipboard: Part 10: The effect of variable climate on the creep behaviour of a range of chipboards and one waferboard von Dinwoodie, J.M., Paxton, B.H., Higgins, Jo-Anne, Robson, D.J.

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Creep in chipboard: Part 11: The effect of cyclic changes in moisture content and temperature on the creep behaviour of a range of boards at different levels of stressing von Dinwoodie, J.M., Higgins, Jo-Anne, Paxton, B.H., Robson, D.J.

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Creep in chipboard. 11. The effect of cyclic changes in moisture content and temperature on the creep behaviour of a range of boards at different levels of stressing von Dinwoodie, J.M, Higgins, J.A, Paxton, B.H, Robson, D.J

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Creep in chipboard. 8. The effect of steady-state moisture content, temperature and level of stressing on the relative creep behaviour and creep modulus of a range of boards von Dinwoodie, J.M. (Building Research Establishment, Watford), Robson, D.J, Paxton, B.H, Higgins, J.S

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Creep in chipboard: Part 9: The effect of steady-state moisture content, temperature and level of stressing on the components of creep deflection for a range of boards von Dinwoodie, J.M., Higgins, J.-A., Paxton, B.H., Robson, D.J.

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Creep in chipboard. 10. The effect of variable climate on the creep behaviour of a range of chipboards and one waferboard von Dinwoodie, J.M. (Building Research Establishment, Watford), Paxton, B.H, Higgins, J.S, Robson, D.J

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Creep in chipboard: Part 7: Testing the efficacy of models on 7?10 years data and evaluating optimum period of prediction von Dinwoodie, J.M.W., Higgins, J.-A., Robson, D.J., Paxton, B.H.

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Creep in chipboard. 9. The effect of steady-state moisture content, temperature and level of stressing on the components of creep deflection for a range of boards von Dinwoodie, J.M. (Building Research Establishment, Watford), Higgins, J.A, Paxton, B.H, Robson, D.J

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Creep in chipboard. 5. An improved model for prediction of creep deflection von Pierce, C.B, Dinwoodie, J.M, Paxton, B.H

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Creep in chipboard. 7. Testing the efficacy of models on 7-10 years data and evaluating optimum period of prediction von Dinwoodie J.M.W, Higgins J.A, Robson D.J, Paxton B.H

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Creep in chipboard. 4. The influence of temperature and moisture content on the creep behaviour of a range of boards at a single stress level von Dinwoodie J.M.W, Pierce C.B, Paxton B.H

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Creep in chipboard. 6. Time to failure analysis under steady state conditions von Pierce, C.B, Dinwoodie, J.M, Paxton, B.H

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Creep in chipboard. 3. Initial assessment of the influence of moisture content and level of stressing on rate of creep and time to failure von Dinwoodie J.M, Paxton B.H, Pierce C.B

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Creep research on particleboard. 15 year's work at the UK Building Research Establishment von Dinwoodie, J.M. (Building Research Establishment, Watford (UK). Dept. of Environment), Higgins, J.A, Paxton, B.H, Robson, D.J

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Lewis X component in human milk binds DC-SIGN and inhibits HIV-1 transfer to CD4+ T lymphocytes von Naarding, Marloes A, Ludwig, Irene S, Groot, Fedde, Berkhout, Ben, Geijtenbeek, Teunis B H, Pollakis, Georgios, Paxton, William A

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