Development of an adhesive-bonded counterflow microchannel heat exchanger von Paulraj, Prawin, Paul, Brian K., Peterson, Richard B.

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Metal microchannel lamination using surface mount adhesives for low-temperature heat exchangers von Paulraj, Prawin, Paul, Brian K.

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MICROCHANNEL STRUCTURES HAVING BONDED LAYERS INCLUDING HEIGHT CONTROL FEATURES von PAULRAJ PRAWIN, PAUL BRIAN K

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MICROCHANNEL STRUCTURES HAVING BONDED LAYERS INCLUDING HEIGHT CONTROL FEATURES von PAULRAJ, PRAWIN, PAUL, BRIAN, K

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MICROCHANNEL STRUCTURES HAVING BONDED LAYERS INCLUDING HEIGHT CONTROL FEATURES von PAULRAJ, PRAWIN, PAUL, BRIAN, K

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Lead-free limits on reflow: tests reveal some of the parameters for successful lead-free printed circuit board assembly.(Electronics Assembly) von Paulraj, Prawin, Armendariz, Norman J

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Alternative lead-free solder joint integrity under room temperature mechanical load von Phil Geng, Aspandiar, R., Byrne, T., Pon, F., Daewoong Suh, McAllister, A., Nazario, A., Paulraj, P., Armendariz, N., Martin, T., Worley, T.

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Lead-free Limits on Reflow von Paulraj, Prawin, Armendariz, Norman J

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