A Concept of Water Usage Efficiency to Support Water Reduction in Manufacturing Industry von Sachidananda, Madhu, Webb, D Patrick, Rahimifard, Shahin

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Areal Surface Texture Parameters for Copper/Glass Plating Adhesion Characteristics von He, Baofeng, Webb, D. Patrick, Petzing, Jon

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Capability evaluation of real-time inline COD detection technique for dynamic water footprint management in the beverage manufacturing industry von Cui, Xinyue, Webb, D. Patrick, Rahimifard, Shahin

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Characterization of metal‐polymer interaction forces by AFM for insert molding applications von Abhyankar, Hrushikesh, Webb, D. Patrick, West, Geoff D., Hutt, David A.

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In-plant real-time manufacturing water content characterisation von Webb, D. Patrick, Skouteris, George, Rahimifard, Shahin

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Assessment of the capability of an optical sensor for in-line real-time wastewater quality analysis in food manufacturing von Skouteris, George, Webb, D. Patrick, Shin, Kei Lok Felix, Rahimifard, Shahin

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Bleeding Zenker's Diverticulum Ulcer from Nonsteroidal Anti-Inflammatory Drugs von House, Tyler, Webb, Patrick D

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Low frequency induction heating for the sealing of plastic microfluidic systems von Knauf, Benedikt J., Webb, D. Patrick, Liu, Changqing, Conway, Paul P.

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A decision tool for improving manufacturing water usage efficiency von Sachidananda, Madhu, Rahimifard, Shahin, Webb, D. Patrick

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Intelligent Assessment of Reusable Plastic Food Packaging for a Circular Supply Chain von Mariam Qaiser, Elliot Woolley, James Colwill, Fiona L. Hatton, D. Patrick Webb

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UK PCB Industry 1997 to 2003 von Reed, Fiona M., Patrick Webb, D., Walsh, Kathryn, Carpineta, Paride

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Forging New Frontiers in Sustainable Food Manufacturing von Rahimifard, Shahin, Woolley, Elliot, Webb, D. Patrick, Garcia-Garcia, Guillermo, Stone, Jamie, Jellil, Aicha, Gimenez-Escalante, Pedro, Jagtap, Sandeep, Trollman, Hana

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Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics von Webb, D.P., Hutt, D.A., Hopkinson, N., Conway, P.P., Palmer, P.J.

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Integration and Packaging of Microsystems by Polymer Overmoulding von Patrick Webb, D., Hutt, D.A., Hopkinson, N., Palmer, P.J., Conway, P.P.

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Bleeding Zenker's Diverticulum Ulcer from Nonsteroidal Anti-Inflammatory Drugs von House, Tyler, Webb, Patrick D

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Effect of insert temperature on integrity of a thermoplastic circuit board von Abhyankar, H, Webb, D P, Hutt, D A

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Polymer bonding by induction heating for microfluidic applications von Knauf, B J, Webb, D P, Changqing Liu, Conway, P P

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Adhesion of Thermoplastics to Materials used in Electronics (Tin) von Abhyankar, H., Webb, D.P., Hutt, D.A., West, G.

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Plastic Packaging Using Low Frequency Induction Heating (LFIH) For Microsystems von Knauf, B.J., Webb, D.P., Liu, C., Conway, P.P.

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Packaging of polymer based microfluidic systems using low frequency induction heating (LFIH) von Knauf, B.J., Webb, D.P., Changqing Liu, Conway, P.P.

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