Self-Biased Inductor-less Interface Circuit for Electret-Free Electrostatic Energy Harvesters von Lefeuvre, E, Risquez, S, Wei, J, Woytasik, M, Parrain, F

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Mechanical resistance of patterned BCB bonded joints for MEMS packaging von Cuminatto, C., Braccini, M., Schelcher, G., Parry, G., Parrain, F.

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Large initial compressive stress in top-down fabricated silicon nanowires evidenced by static buckling von Allain, P E, Le Roux, X, Parrain, F, Bosseboeuf, A

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Reliability study of Piezoelectric Structures Dedicated to Energy Harvesting by the Way of Blocking Force Investigation von Maaroufi, S, Parrain, F, Lefeuvre, E, Boutaud, B, Molin, R Dal

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MEMS packaging process by film transfer using an anti-adhesive layer von Brault, Sebastien, Garel, O., Schelcher, G., Isac, N., Parrain, F., Bosseboeuf, A., Verjus, F., Desgeorges, M., Dufour-Gergam, E.

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Scanning electron microscopy for vacuum quality factor measurement of small-size MEMS resonators von Gilles, J.P., Megherbi, S., Raynaud, G., Parrain, F., Mathias, H., Leroux, X., Bosseboeuf, A.

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A sweeping mode integrated fingerprint sensor with 256 tactile microbeams von Charlot, B., Parrain, F., Galy, N., Basrour, S., Courtois, B.

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Large-Range MEMS Motion Detection With Subangström Noise Level Using an Integrated Piezoresistive Silicon Nanowire von Allain, P. E., Parrain, F., Bosseboeuf, A., Maaroufi, S., Coste, P., Walther, A.

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Generation of Electrically Induced Stimuli for MEMS Self-Test von Charlot, Benoît, Mir, Salvador, Parrain, Fabien, Courtois, Bernard

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MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer von Schelcher, G., Brault, S., Parrain, F., Lefeuvre, E., Dufour-Gergam, E., Tatoulian, M., Bouville, D., Desgeorges, M., Verjus, F., Bosseboeuf, A.

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Electrically induced stimuli for MEMS self-test von Charlot, B., Mir, S., Parrain, F., Courtois, B.

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Microbeams with electronically controlled high thermal impedance von Mir, S, Parrain, F, Charlot, B, Veychard, D

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Micro Pirani vacuum gauges manufactured by a film transfer process von Schelcher, G., Lefeuvre, E., Brault, S., Parrain, F., Martincic, E., Dufour-Gergam, E., Bosseboeuf, A.

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Multilayer Au-Si Eutectic Wafer Bonding with Microstructured Sealing Rings von Lani, Sebastien, Bosseboeuf, Alain, Garel, Olivier, Parrain, Fabien, Isac, Nathalie, Bouville, David, Le Roux, Xavier

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MEMS Process by Film Transfer Using Fluorocarbon Anti-Adhesive Layer von Schelcher, Guillaume, Brault, Sebastien, Parrain, Fabien, Lefeuvre, Elie, Dufour-Gergam, Elisabeth, Tatoulian, Michael, Bouville, David, Desgeorges, Martial, Verjus, Fabrice, Bosseboeuf, Alain

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A sweeping mode integrated tactile fingerprint sensor von Charlot, B., Parrain, F., Galy, N., Courtois, B.

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Experimental measurements and behavioral modeling of an electrostatically actuated bi-axial micromirror von PARRAIN, Fabien, MEGHERBI, Souhil, RAYNAUD, Gilles, MATHIAS, Hervé, GILLES, Jean-Paul, BOSSEBOEUF, Alain, SCHRÖPFER, Gerold, FAURE, Nicolas, CUSIN, Pierre

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Hardware description language modeling of an electrostatically actuated bi-axial micromirror von Parrain, F., Megherbi, S., Raynaud, G., Mathias, H., Gilles, J.-P., Bosseboeuf, A., Schropfer, G., Faure, N., Cusin, P.

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High-Q silicon flexural resonators for vibrating inertial sensors: Investigations of the limiting damping mechanisms von Le Foulgoc, B., Le Traon, O., Masson, S., Parent, A., Bourouina, T., Marty, F., Bosseboeuf, A., Parrain, F., Mathias, H., Gilles, J.-P.

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Large range MEMS motion detection using integrated piezo-resistive silicon nanowire von Allain, P. E., Bosseboeuf, A., Parrain, F., Maaroufi, S., Coste, P., Walther, A.

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