Effect of texture and grain size on the residual stress of nanocrystalline thin films von Cao, Lei, Sengupta, Arkaprabha, Pantuso, Daniel, Koslowski, Marisol

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Poisson’s ratio and residual strain of freestanding ultra-thin films von Cuddalorepatta, Gayatri K., van Rees, Wim M., Han, Li, Pantuso, Daniel, Mahadevan, L., Vlassak, Joost J.

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Residual stress–driven test technique for freestanding ultrathin films: Elastic behavior and residual strain von Cuddalorepatta, Gayatri K., Sim, Gi-Dong, Li, Han, Pantuso, Daniel, Vlassak, Joost J.

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Porosity scaling strategies for low-k films von Michalak, David J., Blackwell, James M., Torres, Jessica M., Sengupta, Arkaprabha, Kreno, Lauren E., Clarke, James S., Pantuso, Daniel

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Industrial TCAD: Modeling Atoms to Chips von Stettler, Mark A., Cea, Stephen M., Hasan, Sayed, Jiang, Lei, Keys, Patrick H., Landon, Colin D., Marepalli, Prabakar, Pantuso, Daniel, Weber, Cory E.

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Measurement of the stress-strain behavior of freestanding ultra-thin films von Cuddalorepatta, Gayatri K., Li, Han, Pantuso, Daniel, Vlassak, Joost J.

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A formulation of the MITC4 shell element for finite strain elasto-plastic analysis von Dvorkin, Eduardo N., Pantuso, Daniel, Repetto, Eduardo A.

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Die Stacking (3D) Microarchitecture von Black, Bryan, Annavaram, Murali, Brekelbaum, Ned, DeVale, John, Jiang, Lei, Loh, Gabriel H., McCaule, Don, Morrow, Pat, Nelson, Donald W., Pantuso, Daniel, Reed, Paul, Rupley, Jeff, Shankar, Sadasivan, Shen, John, Webb, Clair

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Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects von Sadasiva, Subramanya, Subbarayan, Ganesh, Jiang, Lei, Pantuso, Daniel

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Phase Field Simulations of Electromigration Driven Failure in SnAgCu Solder Interconnects von Sadasiva, Subramanya, Subbarayan-Shastri, Ganesh, Jiang, Lei, Pantuso, Daniel, Sane, Sandeep

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A finite element procedure for the analysis of thermo-mechanical solids in contact von Pantuso, Daniel, Bathe, Klaus-Jürgen, Bouzinov, Pavel A.

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Reducing in-plane distortion from wafer to wafer bonding using a dummy wafer von Pawashe, Chytra, Pantuso, Daniel

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Die-package stress interaction impact on transistor performance von Leatherman, G. S., Xu, J., Hicks, J., Kilic, B., Pantuso, D.

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Net-level reliability analysis for interconnect self-heat von Lei Jiang, Pantuso, D., Schmitz, A., Thomas, J.

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A finite element formulation for finite strain elasto-plastic analysis based on mixed interpolation of tensorial components von Dvorkin, Eduardo N, Pantuso, Daniel, Repetto, Eduardo A

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A FEM/VOF hybrid formulation for underfill encapsulation modeling von Pantuso, Daniel, Jiang, Lei, Shankar, Sadasivan, Skokov, Sergei

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METHODS AND APPARATUS TO IMPLEMENT THERMAL GRADIENT PROJECTION AND DESIGN FEEDBACK ON POWER DELIVERY von Hicks, Jeffrey, Komeyli, Kambiz, Jiang, Lei, Sethuraman, Satish, Pantuso, Daniel

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REDUCING IN-PLANE DISTORTION FROM WAFER TO WAFER BONDING USING A DUMMY WAFER von PAWASHE, Chytra, PANTUSO, Daniel

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Critical thermal issues in nanoscale IC design von Lei Jiang, Pantuso, D., Sverdrup, P.G., Wei-kai Shih

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On the stability of mixed finite elements in large strain analysis of incompressible solids von Pantuso, Daniel, Bathe, Klaus-Jürgen

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