Fracture characterization of thin-films by dual tip indentation von Trueba, M., Gonzalez, D., Martínez-Esnaola, J.M., Hernandez, M.T., Pantuso, D., Li, H., Elizalde, M.R., Ocaña, I.

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Assessment of mechanical properties of metallic thin-films through micro-beam testing von Trueba, M., Gonzalez, D., Elizalde, M.R., Martínez-Esnaola, J.M., Hernandez, M.T., Li, H., Pantuso, D., Ocaña, I.

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Fracture characterization of brittle thin-films by membrane testing von Trueba, M., Gonzalez, D., Martínez-Esnaola, J.M., Hernandez, M.T., Pantuso, D., Li, H., Ocaña, I., Elizalde, M.R.

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Interfacial fracture induced by cross-sectional nanoindentation in metal–ceramic thin film structures von Elizalde, M.R., Sánchez, J.M., Martínez-Esnaola, J.M., Pantuso, D., Scherban, T., Sun, B., Xu, G.

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Fracture characterization in patterned thin films by cross-sectional nanoindentation von Ocaña, I., Molina-Aldareguia, J.M., Gonzalez, D., Elizalde, M.R., Sánchez, J.M., Martínez-Esnaola, J.M., Gil Sevillano, J., Scherban, T., Pantuso, D., Sun, B., Xu, G., Miner, B., He, J., Maiz, J.

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Cross-sectional nanoindentation: a new technique for thin film interfacial adhesion characterization von Sánchez, J.M., El-Mansy, S., Sun, B., Scherban, T., Fang, N., Pantuso, D., Ford, W., Elizalde, M.R., Martı́nez-Esnaola, J.M., Martı́n-Meizoso, A., Gil-Sevillano, J., Fuentes, M., Maiz, J.

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Assessment of fracture and elastoplastic properties of thin and very thin films von Trueba, M, Gonzalez, D, Ocaña, I, Elizalde, M R, Martinez-Esnaola, J M, Hernandez, M T, Haverty, M, Xu G, Pantuso, D

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Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures von Park, T.-S., Dao, M., Suresh, S., Rosakis, A.J., Pantuso, D., Shankar, S.

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Self-heat reliability considerations on Intel's 22nm Tri-Gate technology von Prasad, C., Jiang, L., Singh, D., Agostinelli, M., Auth, C., Bai, P., Eiles, T., Hicks, J., Jan, C. H., Mistry, K., Natarajan, S., Niu, B., Packan, P., Pantuso, D., Post, I., Ramey, S., Schmitz, A., Sell, B., Suthram, S., Thomas, J., Tsai, C., Vandervoorn, P.

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Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation von Scherban, T., Pantuso, D., Sun, B., El-Mansy, S., Xu, J., Elizalde, M.R., Sánchez, J.M., Martínez-Esnaola, J.M.

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A finite element procedure for the analysis of thermo-mechanical solids in contact von Pantuso, Daniel, Bathe, Klaus-Jürgen, Bouzinov, Pavel A.

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Die-package stress interaction impact on transistor performance von Leatherman, G. S., Xu, J., Hicks, J., Kilic, B., Pantuso, D.

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Net-level reliability analysis for interconnect self-heat von Lei Jiang, Pantuso, D., Schmitz, A., Thomas, J.

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A FEM/VOF hybrid formulation for underfill encapsulation modeling von Pantuso, Daniel, Jiang, Lei, Shankar, Sadasivan, Skokov, Sergei

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A formulation of the MITC4 shell element for finite strain elasto-plastic analysis von Dvorkin, Eduardo N., Pantuso, Daniel, Repetto, Eduardo A.

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On the stability of mixed finite elements in large strain analysis of incompressible solids von Pantuso, Daniel, Bathe, Klaus-Jürgen

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Critical thermal issues in nanoscale IC design von Lei Jiang, Pantuso, D., Sverdrup, P.G., Wei-kai Shih

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Adhesion studies in integrated circuit interconnect structures von Molina-Aldareguia, J.M., Ocaña, I., González, D., Elizalde, M.R., Sánchez, J.M., Martínez-Esnaola, J.M., Gil-Sevillano, J., Scherban, T., Pantuso, D., Sun, B., Xu, G., Miner, B., He, J., Maiz, J.

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On the stabililty of mixed finite elements in large strain analysis of incompressible solids von Bathe, K-J, Pantuso, D

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Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation: Fracture nanomechanics von SCHERBAN, T, PANTUSO, D, SUN, B, EL-MANSY, S, XU, J, ELIZALDE, M. R, SANCHEZ, J. M, MARTINEZ-ESNAOLA, J. M

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