Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy von Shi, X. Q, Wang, Z. P, Yang, Q. J, Pang, H. L. J

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Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au von Ngoh, S.L., Zhou, W., Pang, J.H.L.

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A New Creep Constitutive Model for Eutectic Solder Alloy von Shi, X. Q, Wang, Z. P, Zhou, W, Pang, H. L. J, Yang, Q. J

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A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks von Huang, Z., Kumar, P., Dutta, I., Pang, J.H.L., Sidhu, R.

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Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging von Pang, H.L.J, Tan, K.H, Shi, X.Q, Wang, Z.P

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Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy von Shi, X.Q, Pang, H.L.J, Zhou, W, Wang, Z.P

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Wireless Strain Sensors for Dynamic Stress Analysis of Rail Steel Structural Integrity von Shi, X. P., Liu, Z. F., Tsang, K. S., Hoh, H. J., Liu, Y., Kaijun, Kelvin Tan, Yong, Phua Song, Kelvin, Pang, J. H. L.

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Determination of interface fracture toughness of adhesive joint subjected to mixed-mode loading using finite element method von Shi, X.Q., Zhang, X.R., Pang, J.H.L.

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Dynamic finite element modeling and fatigue damage analysis of thermite welds von Liu, Z., Shi, X., Tsang, K.S., Hoh, H.J., Pang, J.H.L.

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A modified energy-based low cycle fatigue model for eutectic solder alloy von Shi, X.Q, Pang, H.L.J, Zhou, W, Wang, Z.P

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Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging von Xu, Luhua, Pang, John H.L.

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Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength von Pang, John H.L., Low, T.H., Xiong, B.S., Luhua, Xu, Neo, C.C.

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Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens von Shi, X.Q., Wang, Z.P., Pang, H.L.J., Zhang, X.R.

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Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions von Huang, Z., Kumar, P., Dutta, I., Pang, J.H.L., Sidhu, R., Renavikar, M., Mahajan, R.

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Low cycle fatigue models for lead-free solders von Pang, John H.L., Xiong, B.S., Low, T.H.

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Low cycle fatigue study of lead free 99.3Sn–0.7Cu solder alloy von Pang, John H.L., Xiong, B.S., Low, T.H.

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Mixed mode fracture analysis and toughness of adhesive joints von Pang, H.L.J.

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Reliability Centred Maintenance (RCM) Assessment of Rail Wear Degradation von Hoh, H. J., Wang, J. L., Nellian, A. S., Pang, J. H. L.

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FATIGUE ANALYSIS OF SURFACE CRACKS AT FILLET WELDED TOES von Pang, H. L. J., Gray, T. G. F.

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Three-dimensional finite element analysis of a tubular T-joint under combined axial and bending loading von Pang, H.L.J., Lee, C.W.

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