Experimental evaluation of electrical conductivity of microtubules von UMNOV, M, PALUSINSKI, O. A, DEYMIER, P. A, GUZMAN, R, HOYING, J, BARNABY, H, YANG, Y, RAGHAVAN, S

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Clarification of a decoupling method for multiconductor transmission lines von Szidarovszky, F., Palusinski, O.A.

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Electrophoresis: Mathematical Modeling and Computer Simulation von Bier, M., Palusinski, O. A., Mosher, R. A., Saville, D. A.

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Theory of electrophoretic separations. Part I: Formulation of a mathematical model von Saville, D. A., Palusinski, O. A.

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Analysis of transients in nonuniform and uniform multiconductor transmission lines von Palusinski, O.A., Lee, A.

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Theory of electrophoretic separations. Part II: Construction of a numerical simulation scheme and its applications von Palusinski, O. A., Graham, A., Mosher, R. A., Bier, M., Saville, D. A.

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METHOD FOR ORDERING INTEGRATED CIRCUIT EQUATIONS IN SPECTRAL ANALYSIS OF THEIR TRANSIENT BEHAVIOR von Palusinski, O.A., Abdennadher, M.

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New matrix algorithm for calculating diagonally matched impedance of packaging interconnecting lines von You, Y., Palusinski, O.A., Szidarovszky, F.

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Theory of electrophoretic separations. I - Formulation of a mathematical model von Saville, D. A., Palusinski, O. A.

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Isotachophoresis: analysis and computation of the structure of the ionic species interface von Su, Y., Palusinski, O.A., Fife, P.C.

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Procedure for direct calculation of characteristic admittance matrix of coupled transmission lines von Reiss, K., Palusinski, O.A.

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Theory of electrophoretic separations. II - Construction of a numerical simulation scheme and its applications von Palusinski, O. A., Graham, A., Mosher, R. A., Bier, M., Saville, D. A.

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Mathematical model for transient isoelectric focusing of simple ampholytes von Palusinski, O.A., Bier, M., Saville, D.A.

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Modification of 'SPICE' for simulation of coupled packaging interconnections von Lee, D., Palusinski, O.A.

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Mathematical modeling and computer simulation of isoelectric focusing with electrochemically defined ampholytes von Palusinski, O.A., Allgyer, T.T., Mosher, R.A., Bier, M., Saville, D.A.

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Effect of randomness of Cu-Sn intermetallic compound layer thickness on reliability of surface mount solder joints von Huang, W., Palusinski, O.A., Dietrich, D.L.

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A Chebyshev expansion method for solving Nonlinear circuit equations von Palusinski, Olgierd A., Szidarovszky, Ferenc

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Trench etches in silicon with controllable sidewall angles von CARLILE, R. N, LIANG, V. C, PALUSINSKI, O. A, SMADI, M. M

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Numerical technique and computational procedure for isotachophoresis von Palusinski, Olgierd A., Su, Yu, Fife, Paul C.

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Computer simulation and experimental validation of isoelectric focusing in ampholine-free systems von Bier, M., Mosher, R.A., Palusinski, O.A.

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