Impact of the ROHS Directive on high-performance electronic systems: Part II: key reliability issues preventing the implementation of lead-free solders von Puttlitz, Karl J, Galyon, George T

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Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys von Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.

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Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu von Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung

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Impact of the ROHS directive on high-performance electronic systems: Part I: need for lead utilization in exempt systems von Puttlitz, Karl J, Galyon, George T

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Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates von KORHONEN, Tia-Marje K, TURPEINEN, Pekka, LEHMAN, Lawrence P, BOWMAN, Brian, THIEL, George H, PARKES, Raymond C, KORHONEN, Matt A, HENDERSON, Donald W, PUTTLITZ, Karl J

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The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue von Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.

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Interfacial reaction studies on lead (Pb)-free solder alloys von Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Myung-Jin Yim, Advocate, G.G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T.A., King, D.E., Konrad, J.J., Sarkhel, A., Puttlitz, K.J.

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Impact of the ROHS directive on high-performance electronic systems von Puttlitz, Karl J, Galyon, George T

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Impact of the ROHS Directive on high-performance electronic systems von Puttlitz, Karl J, Galyon, George T

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Impact of the ROHS directive on high-performance electronic systems. Part I need for lead utilization in exempt systems: Lead-free electronic solders von PUTTLITZ, Karl J, GALYON, George T

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Impact of the ROHS Directive on high-performance electronic systems. Part II key reliability issues preventing the implementation of lead-free solders: Lead-free electronic solders von PUTTLITZ, Karl J, GALYON, George T

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Ag 3 Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys von Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.

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Solder transfer technique for flip chip and electronic assembly applications von Puttlitz, K.J., Lidestri, K.A., Totta, P.A.

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Flip-chip replacement within the constraints imposed by multilayer ceramic (MLC) modules von Puttlitz, Karl J.

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METHOD FOR THE PRODUCTION OF A LEAD-FREE TIN, SILVER, COPPER ALLOY SOLDER COMPOSITION AND AN ELECTRONIC STRUCTURE von CHOI, WON, K, GOLDSMITH, CHARLES, C, KANG, SUNG, K, SHIH, DA-YUAN, HENDERSON, DONALD, W, GOSSELIN, TIMOTHY, A, PUTTLITZ, KARL J., SR

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Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip-chips attached to gold capped microsockets von Puttlitz, K.J.

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Corrosion of Pb-50In flip-chip interconnections exposed to harsh environment von Puttlitz, K.J.

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C-4/CBGA comparison with other MLC single chip package alternatives von Puttlitz, K.J., Shutler, W.F.

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C-4/BGA comparison with other MLC single chip package alternatives von Puttlitz, K.J., Shutler, W.F.

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Apparatus and method for removing meltable material from a substrate von DOWNING, ANDREW J, PUTTLITZ, KARL J, FOSTER, DONALD C

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