Treffer 1 - 5 von 5 für Suche 'PUSHPALA SAGAR', Suchdauer: 0,30s Treffer weiter einschränken
  1. 1
    Bond pad configurations for semiconductor dies

    Bond pad configurations for semiconductor dies von KELKAR NIKHIL VISHWANATH, PUSHPALA SAGAR, ANKIREDDI SESHASAYEE SS

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  2. 2
    BOND PAD CONFIGURATIONS FOR SEMICONDUCTOR DIES

    BOND PAD CONFIGURATIONS FOR SEMICONDUCTOR DIES von KELKAR NIKHIL VISHWANATH, PUSHPALA SAGAR, ANKIREDDI SESHASAYEE SS

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  3. 3
    MOST contact structure, especially a gate contact structure, is produced using an etch-stop layer to protect the gate and adjacent side wall spacer during contact opening etching

    MOST contact structure, especially a gate contact structure, is produced using an etch-stop layer to protect the gate and adjacent side wall spacer during contact opening etching von PUSHPALA, SAGAR, KITCH, VASSILI

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  4. 4
    Dual side fabricated semiconductor wafer

    Dual side fabricated semiconductor wafer von PUSHPALA, SAGAR, NAEM, ABDALLA

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  5. 5
    Production of integrated circuit elements where CD microloading is eliminated or controlled and etching biasing is eliminated or minimized

    Production of integrated circuit elements where CD microloading is eliminated or controlled and etching biasing is eliminated or minimized von JIN, RAYMOND R, PUSHPALA, SAGAR M

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