Packaging and Assembly for Integrated Photonics-A Review of the ePIXpack Photonics Packaging Platform von Zimmermann, L, Preve, G B, Tekin, T, Rosin, T, Landles, K

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Experimental demonstration of a 24-port packaged multi-microring network-on-chip in silicon photonic platform von Gambini, Fabrizio, Pintus, Paolo, Faralli, Stefano, Chiesa, Marco, Preve, Giovan Battista, Cerutti, Isabella, Andriolli, Nicola

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Design and Implementation of an Integrated Reconfigurable Silicon Photonics Switch Matrix in IRIS Project von Testa, Francesco, Oton, Claudio J., Kopp, Christophe, Jong-Moo Lee, Ortuno, Ruben, Enne, Reinhard, Tondini, Stefano, Chiaretti, Guido, Bianchi, Alberto, Pintus, Paolo, Min-Su Kim, Fowler, Daivid, Ayucar, Jose Angel, Hofbauer, Michael, Mancinelli, Mattia, Fournier, Maryse, Battista Preve, Giovan, Zecevic, Nikola, Manganelli, Costanza L., Castellan, Claudio, Pares, Gabriel, Lemonnier, Olivier, Gambini, Fabrizio, Labeye, Pierre, Romagnoli, Marco, Pavesi, Lorenzo, Zimmermann, Horst, Di Pasquale, Fabrizio, Stracca, Stefano

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Colorless ONU With Discolored Source and Hybrid SOI Integrated Wavelength Converter von Lazarou, I., Stamatiadis, C., Schrenk, B., Stampoulidis, L., Zimmermann, L., Voigt, K., Preve, G. B., Moerl, L., Kreissl, J., Avramopoulos, H.

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Integrated Silicon-on-Insulator Optical Comb Demultiplexer for Elastic Optical Networks von Porzi, Claudio, Nottola, Alessandro, Tirelli, Stefano, Preve, Giovan Battista, Sorel, Marc, Bogoni, Antonella

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Silicon Photonics Packaging Automation: Problems, Challenges, and Considerations von Preve, Giovan Battista

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Photonic - Electronic platform for next generation optical transport network von Kroh, Marcel, O'Keefe, Matthew, Voigt, Karsten, Fedderwitz, Sascha, Battista Preve, Giovan, Lischke, Stefan, Brast, Tino, Petousi, Despoina, Stamatiadis, Christos, Kehayas, Efstratios, Nogueira, Rogerio, Korn, Dietmar, Roccato, Diego, Schindler, Philipp C., Lazarou, Ioannis, Koos, Christian, Freude, Wolfgang, Leuthold, Juerg, Avramopoulos, Hercules, Steffan, Andreas G., Stampoulidis, Leontios, Zimmermann, Lars

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Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform von Zimmermann, Lars, Preve, Giovan Battista, Tekin, Tolga, Rosin, T, Landles, K

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DEVICE FOR THE EFFICIENT LOW-PROFILE ENCAPSULATION OF PHOTONIC INTEGRATED CIRCUITS VERTICALLY COUPLED TO A FIBER von LANG, GUENTER, SANCHIS KILDERS, PABLO, TEKIN, TOLGA, KRISSLER, JAN, PREVE, GIOVAN BATTISTA, GALAN CONEJOS, JOSE VICENTE, MARX, SEBASTIAN, MARTI SENDRA, JAVIER

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DISPOSITIVO PARA EL ENCAPSULADO EFICIENTE DE BAJO PERFIL DE CIRCUITOS INTEGRADOS FOTONICOS CON ACOPLO A FIBRA VERTICAL von LANG, GUENTER, SANCHIS KILDERS, PABLO, TEKIN, TOLGA, KRISSLER, JAN, PREVE, GIOVAN BATTISTA, GALAN CONEJOS, JOSE VICENTE, MARX, SEBASTIAN, MARTI SENDRA, JAVIER

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DISPOSITIVO PARA EL ENCAPSULADO EFICIENTE DE BAJO PERFIL DE CIRCUITOS INTEGRADOS FOTONICOS CON ACOPLO A FIBRA VERTICAL von LANG, GUENTER, SANCHIS KILDERS, PABLO, TEKIN, TOLGA, KRISSLER, JAN, PREVE, GIOVAN BATTISTA, GALAN CONEJOS, JOSE VICENTE, MARX, SEBASTIAN, MARTI SENDRA, JAVIER

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