A study on electrochemical effects in external capacitor packages von Preu, H., Feilmeier, J., Lang, M., Soellner, N., Walter, J., Mack, W.

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Modeling and characterization of molding compound properties during cure von Jansen, K.M.B., Qian, C., Ernst, L.J., Bohm, C., Kessler, A., Preu, H., Stecher, M.

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Inert Phosphorescent Nanospheres as Markers for Optical Assays von Kürner, Jens M, Klimant, Ingo, Krause, Christian, Preu, Harald, Kunz, Werner, Wolfbeis, Otto S

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Mehr Erfolg im Technischen Vertrieb: 15 Schritte, die Sie voranbringen von Preuners, Dirk

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Accurate prediction of SnAgCu solder joint fatigue of QFP packages for thermal cycling von Niessner, M., Schuetz, G., Birzer, C., Preu, H., Weiss, L.

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Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments von Maus, I., Preu, H., Niessner, M., Fink, M., Jansen, K. M. B., Pantou, R., Michel, B., Wunderle, B.

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Light, Neutron, X-ray Scattering, and Conductivity Measurements on Aqueous Dodecyltrimethylammonium Bromide/1-Hexanol Solutions von Preu, Harald, Schirmer, Christine, Tomšič, Matija, Bešter Rogač, Marija, Jamnik, Andrej, Belloni, Luc, Kunz, Werner

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Small angle neutron scattering of D2O-Brij 35 and D2O-alcohol-Brij 35 solutions and their modelling using the Percus-Yevick integral equation von PREU, H, ZRADBA, A, RAST, S, KUNZ, W, HARDY, E. H, ZEIDLER, M. D

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Energy-adjustedab initio pseudopotentials for the second and third row transition elements: Molecular test for M2 (M=Ag, Au) and MH (M=Ru, Os) von Andrae, D., H u ermann, U., Dolg, M., Stoll, H., Preu, H.

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Mehrelektronen-Modelle von Preuß, H, Klessinger, M, Hinze, J

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Temperature Increase due to Homogenization von Mitten, H.L., Preu, H.L.

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Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics von Unterhofer, K., Preu, H., Walter, J., Lorenz, G., Mack, W., Petzold, M.

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Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production von Maus, I., Pape, H., Nabi, H. S., Goroll, M., Preu, H., Keller, J., Ernst, L. J., Michel, B., Wunderle, B.

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Advanced viscoelastic material model for predicting warpage of a QFN panel von de Vreugd, J., Jansen, K.M.B., Xiao, A., Ernst, L.J., Bohm, C., Kessler, A., Preu, H., Stecher, M.

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Die chemische Bindung: Eine verständliche Einführung von Preuß, H, Boschke, F. L

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Energy-adjustedab initio pseudopotentials for the second and third row transition elements von Andrae, D., H u ermann, U., Dolg, M., Stoll, H., Preu, H.

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Effect of postcure and thermal aging on molding compound properties von de Vreugd, J., Monforte, A.S., Jansen, K.M.B., Ernst, L.J., Bohm, C., Kessler, A., Preu, H.

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Effects of Molding Compound Cure on Warpage of Electronic Packages von de Vreugd, J., Jansen, K.M.B., Ernst, L.J., Bohm, C., Kessler, A., Preu, H.

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A characterization method for viscoelastic bulk modulus of molding compounds von Saraswat, M.K., Jansen, K.M.B., Patel, M.D., Ernst, L.J., Bohm, C., Kessler, A., Preu, H., Stecher, M.

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Characterization and modeling of molding compound properties during cure von Jansen, K.M.B., Qian, C., Ernst, L., Bohm, C., Kessler, A., Preu, H., Stecher, M.

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