ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT von POLOMOFF, Nicholas Alexander, Xie, Ruilong, Yang, Chih-Chao, Li, Tao

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SHARED SOURCE/DRAIN CONTACT FOR STACKED FIELD-EFFECT TRANSISTOR von POLOMOFF, Nicholas Alexander, Xie, Ruilong, Motoyama, Koichi, Sigal, Leon

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DIRECT BACKSIDE CONTACT WITH REPLACEMENT BACKSIDE DIELECTRIC von Nguyen, Son, Choi, Kisik, Xie, Ruilong, Polomoff, Nicholas Alexander

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ELECTROSTATIC DISCHARGE USING BACKSIDE POWER DISTRIBUTION NETWORK von Anderson, Brent A, POLOMOFF, Nicholas Alexander, Xie, Ruilong, Arnold, John Christopher, Hook, Terence, Chou, Anthony I

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HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY von Perfecto, Eric, McHerron, Dale Curtis, SKORDAS, SPYRIDON, Polomoff, Nicholas Alexander, Farooq, Mukta Ghate, Sakuma, Katsuyuki

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BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRANSISTORS von Anderson, Brent A, Xie, Ruilong, Yang, Chih-Chao, Polomoff, Nicholas Alexander

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INTEGRATED CIRCUIT CHIP WITH BACKSIDE POWER DELIVERY AND MULTIPLE TYPES OF BACKSIDE TO FRONTSIDE VIAS von Clevenger, Lawrence A, Anderson, Brent A, Chu, Albert M, POLOMOFF, Nicholas Alexander, Lanzillo, Nicholas Anthony, Xie, Ruilong

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STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS von Perfecto, Eric, Belyansky, Michael P, Skordas, Spyridon, Polomoff, Nicholas Alexander, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Raghavan, Sathyanarayanan

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STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS von BELYANSKY, Michael P, POLOMOFF, Nicholas Alexander, FAROOQ, Mukta Ghate, SAKUMA, Katsuyuki, SKORDAS, Spyridon, PERFECTO, Eric, RAGHAVAN, Sathyanarayanan

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HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS von LIE, FEE LI, Clevenger, Lawrence A, Anderson, Brent A, Choi, Kisik, POLOMOFF, Nicholas Alexander, Xie, Ruilong, Angyal, Matthew, Hook, Terence

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