Creep properties of Sn-8Mass%Zn-3mass%Bi lead-free alloy von SHOHJI, Ikuo, GAGG, Colin, PLUMBRIDGE, William J

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Crack Healing in a Silicon Nitride Ceramic von Zhang, Yan Hui, Edwards, Lyndon, Plumbridge, William J.

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The constitutive creep equation for a eutectic Sn-Ag alloy using the modified theta-projection concept von KARIYA, Yoshiharu, OTSUKA, Masahisa, PLUMBRIDGE, William J

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Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements von Leodolter-Dworak, Monika, Steffan, Ilse, Plumbridge, William J., Ipser, Herbert

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Tin pest in lead-free solders von Kariya, Yoshiharu, Gagg, Colin, Plumbridge, William J

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Second Generation Lead-free Solder Alloys – A Challenge to Thermodynamics von Plumbridge, William J.

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Tin pest in leadfree solders von Kariya, Yoshiharu, Gagg, Colin, Plumbridge, William J.

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Perfectionnements aux balais ou aux brosses à polir ou à astiquer von PLUMBRIDGE WILLIAM, CHICK HARRY ROBERT, HELLIWELL FRANK OXLEY

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