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  1. 1
    Hybrid lead frame for semiconductor die package with improved creepage distance

    Hybrid lead frame for semiconductor die package with improved creepage distance von Zhang, Lidong, Phillips, Kendall Dewayne, Carpenter, Burton Jesse, Chen, Quan, Ching, Jr., Mariano Layson, Lye, Meng Kong

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  2. 2
    HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEPAGE DISTANCE

    HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEPAGE DISTANCE von CHEN, Quan, CARPENTER, Burton Jesse, PHILLIPS, Kendall Dewayne, CHING, JR., Mariano Layson, LYE, Meng Kong, ZHANG, Lidong

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  3. 3
    Hybrid lead wire frame for semiconductor pipe core package with improved creepage distance

    Hybrid lead wire frame for semiconductor pipe core package with improved creepage distance von ZHANG LIDONG, KENDALL DEWAYNE PHILLIPS, CHEN QUAN, LYE MENG KONG, BURTON JESSE CARPENTER, MARIANO LAYSON CH JR

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